Related Documents - N & P pair
Application Notes (1)
General Information (1)
Markings (7)
Package Drawings (9)
Pad Guidelines (17)
RC Thermal Models (36)
Reel Info (1)
Reliability Data (19)
Tape Info (14)
Technical Notes (15)
SPICE (134)
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Application Notes
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AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SO-8 |
PART MARKING |
TSOP-5/6 |
PART MARKING |
TSSOP-8 |
Part Marking Information |
devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
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Package Drawings
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5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5547 |
ChipFET (1206-8) |
5550 |
SC-70 6L |
5844 |
TSSOP 8L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
Package Information |
PowerPAK® ChipFET® SINGLE PAD |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
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Pad Guidelines
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AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
AN812 |
Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN814 |
Dual-Channel LITTLE FOOT SC-70 6-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
AN816 |
Dual-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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Si1016CX_GE3_RC |
R-C Thermal Model Parameters |
Si1029X-RC |
RC Thermal Model for Si1029X |
Si1035X-RC |
RC Thermal Model for Si1035X |
Si1040X-RC |
RC Thermal Model for Si1040X |
Si1539CDL_RC |
R-C Thermal Model Parameters |
Si1551DL-RC |
RC Thermal Model for Si1551DL |
Si1553CDL-GE3_RC |
R-C Thermal Model Parameters |
Si1555DL-RC |
RC Thermal Model for Si1555DL |
Si1563DH-RC |
RC Thermal Model for Si1563DH |
Si1563EDH-RC |
RC Thermal Model for Si1563EDH |
Si1869DH-RC |
RC Thermal Model for Si1869DH |
Si3552DV-RC |
RC Thermal Model for Si3552DV |
Si3585CDV_RC |
R-C Thermal Model Parameters |
Si3586DV-RC |
RC Thermal Model for Si3586DV |
Si3588DV-RC |
RC Thermal Model for Si3588DV |
Si3590DV-RC |
RC Thermal Model for Si3590DV |
Si3850ADV-RC |
RC Thermal Model for Si3850ADV |
Si3861BDV-RC |
RC Thermal Model for Si3861BDV |
Si3865DDV-GE3_RC |
R-C Thermal Model Parameters |
Si4500BDY-RC |
RC Thermal Model for Si4500BDY |
Si4501BDY_RC |
R-C Thermal Model Parameters |
Si4511DY-RC |
RC Thermal Model for Si4511DY |
Si4532CDY |
R-C Thermal Model Parameters |
Si4559ADY-RC |
RC Thermal Model for Si4559ADY |
Si4564DY_RC |
R-C Thermal Model Parameters |
Si4599DY-RC |
RC Thermal Model for Si4599DY |
Si4599DY_RC |
R-C Thermal Model Parameters |
Si5504BDC-RC |
RC Thermal Model for Si5504BDC |
Si5513CDC-RC |
RC Thermal Model for Si5513CDC |
Si5513CDC_RC |
R-C Thermal Model Parameters |
Si5515CDC-RC |
RC Thermal Model for Si5515CDC |
Si5515CDC_RC |
R-C Thermal Model Parameters |
Si5517DU-RC |
RC Thermal Model for Si5517DU |
Si6544BDQ-RC |
RC Thermal Model for Si6544BDQ |
Si6562CDQ-RC |
RC Thermal Model for Si6562CDQ |
Si6562CDQ_RC |
R-C Thermal Model Parameters |
Si7540DP-RC |
RC Thermal Model for Si7540DP |
SiA517DJ-RC |
RC Thermal Model for SiA517DJ |
SiA517DJ_RC |
R-C Thermal Model Parameters |
SiA519EDJ |
R-C Thermal Model Parameters |
SiA533EDJ_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data For 1206-8 ChipFET |
Package Reliability |
Environmental and Package Testing Data For PowerPAK ChipFET |
Package Reliability |
Environmental and Package Testing Data For PowerPAK SC-70 |
Package Reliability |
Environmental and Package Testing Data For SC-89 |
Package Reliability |
Environmental and Package Testing Data For SOIC 8 Lead (DY) |
Package Reliability |
Environmental and Package Testing Data For SOIC-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data For TSOP-5/6 |
Package Reliability |
Environmental and Package Testing Data For TSSOP 8 Lead |
Package Reliability |
PowerPAK SO-8 |
Package Reliability |
SC-70-6 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-21 |
Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
Tape Information |
1206-8 ChipFET® |
Tape Information |
PowerPAK® ChipFET® |
Tape Information |
PowerPAK® SC-70 AND THIN PowerPAK SC-70 |
Tape Information |
PowerPAK® SOIC-8 |
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Technical Notes
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Specification Comparison |
Si1016CX vs. Si1016X |
Specification Comparison |
Si1539CDL vs. Si1539DL |
Specification Comparison |
Si1553CDL vs. Si1553DL |
Specification Comparison |
Si3585CDV vs. Si3585DV |
Specification Comparison |
Si3850ADV vs. Si3850DV |
Specification Comparison |
Si4501BDY vs. Si4501ADY |
Specification Comparison |
Si4532CDY vs. Si4532ADY |
Specification Comparison |
Si4559ADY vs. Si4559EY |
Specification Comparison |
Si5504BDC vs. Si5504DC |
Specification Comparison |
Si5513CDC vs. Si5513DC |
Specification Comparison |
Si5515CDC vs. Si5515DC |
Specification Comparison |
Si6562CDQ vs. Si6562DQ |
Specification Comparison: |
Si3861BDV vs. Si3861DV |
Specification Comparison: |
Si4500BDY vs. Si4500DY |
Specification Comparison: |
Si6544BDQ vs. Si6544DQ |
Useful Links
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AN818
Si1029X-H

