Related Documents - N & P pair
Application Notes (2)
General Information (1)
Markings (7)
Package Drawings (9)
Pad Guidelines (16)
RC Thermal Models (31)
Reel Info (1)
Reliability Data (19)
Software Models (*.zip) (3)
Tape Info (14)
Tech Tip (12)
SPICE (115)
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Application Notes
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AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
Application Note AN821 |
PowerPAK® SO-8 Mounting and Thermal Considerations |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SO-8 |
PART MARKING |
TSOP-5/6 |
PART MARKING |
TSSOP-8 |
Part Marking Information |
PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR® 6 x 3.7, PowerPAK 1212-8S, PowerPAIR 6 x 5, PowerPAIR 3 x 3 |
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Package Drawings
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5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5547 |
ChipFET (1206-8) |
5550 |
SC-70 6L |
5844 |
TSSOP 8L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
Package Information |
PowerPAK® ChipFET® Dual PAD |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
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Pad Guidelines
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AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
AN812 |
Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN814 |
Dual-Channel LITTLE FOOT SC-70 6-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
AN816 |
Dual-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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Si1016CX_GE3_RC |
R-C Thermal Model Parameters |
si1029x-rc |
RC Thermal Model for Si1029X |
si1040x-rc |
RC Thermal Model for Si1040X |
Si1539CDL_RC |
R-C Thermal Model Parameters |
Si1553CDL-GE3_RC |
R-C Thermal Model Parameters |
Si1555DL-RC |
RC Thermal Model for Si1555DL |
si1563dh-rc |
RC Thermal Model for Si1563DH |
si1563edh-rc |
RC Thermal Model for Si1563EDH |
si1869dh-rc |
RC Thermal Model for Si1869DH |
si3552dv-rc |
RC Thermal Model for Si3552DV |
Si3585CDV_RC |
R-C Thermal Model Parameters |
si3586dv-rc |
RC Thermal Model for Si3586DV |
si3590dv-rc |
RC Thermal Model for Si3590DV |
Si3865DDV-GE3_RC |
R-C Thermal Model Parameters |
si4500bdy-rc |
RC Thermal Model for Si4500BDY |
Si4501BDY_RC |
R-C Thermal Model Parameters |
si4511dy-rc |
RC Thermal Model for Si4511DY |
Si4532CDY |
R-C Thermal Model Parameters |
Si4554DY-GE3_RC |
R-C Thermal Model Parameters |
si4559ady-rc |
RC Thermal Model for Si4559ADY |
Si4564DY_RC |
R-C Thermal Model Parameters |
Si4599DY_RC |
R-C Thermal Model Parameters |
si5504bdc-rc |
RC Thermal Model for Si5504BDC |
Si5513CDC_RC |
R-C Thermal Model Parameters |
Si5515CDC_RC |
R-C Thermal Model Parameters |
si5517du-rc |
RC Thermal Model for Si5517DU |
Si6562CDQ_RC |
R-C Thermal Model Parameters |
si7540dp-rc |
RC Thermal Model for Si7540DP |
SiA517DJ_RC |
R-C Thermal Model Parameters |
SiA519EDJ |
R-C Thermal Model Parameters |
SiA533EDJ_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for ChipFET® (1206-8) |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 |
Package Reliability |
Environmental and Package Testing Data for SC-70 |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Software Models (*.zip)
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Si1539CDL-zip |
SPICE Models for Si1539CDL |
Si3585CDV-zip |
SPICE Models for Si3585CDV |
Si4554DY-zip |
SPICE Models for Si4554DY |
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Tape Info
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90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
Device Orientation |
Device Orientation for PowerPAK 1212-8, PowerPAK 1212-8S, and PowerPAK SO-1 |
Device Orientation |
Device OrientationPowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
Tape Information |
1206-8 ChipFET® |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAK® ChipFET® |
Tape Information |
PowerPAK® SOIC-8 |
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Tech Tip
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Specification Comparison |
Si1016CX vs. Si1016X |
Specification Comparison |
Si1539CDL vs. Si1539DL |
Specification Comparison |
Si1553CDL vs. Si1553DL |
Specification Comparison |
Si3585CDV vs. Si3585DV |
Specification Comparison |
Si4501BDY vs. Si4501ADY |
Specification Comparison |
Si4532CDY vs. Si4532ADY |
Specification Comparison |
Si4559ADY vs. Si4559EY |
specification comparison |
Si5504BDC vs. Si5504DC |
Specification Comparison |
Si5513CDC vs. Si5513DC |
Specification Comparison |
Si5515CDC vs. Si5515DC |
Specification Comparison |
Si6562CDQ vs. Si6562DQ |
Specification Comparison: |
Si4500BDY vs. Si4500DY |
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AN818
si1029x-h


