Related Documents - Vishay MOSFETs, P-channel, 1.5 V rated on-resistance

Related Documents

  Application Note (1)
  Markings (5)
  Pad Guidlines (16)
  Package Drawing (6)
  Reliability Data (10)
  Reel Info (1)
  RC Thermal Models (21)
  Tape Info (17)
  SPICE (70)

Pad Guidlines
AN811	Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC70 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Single	Recommended Minimum PAD Pattern
AN826 - SC-70: 6-Lead	Recommended Minimum PAD Pattern
AN826 - SC-89: 6-Lead	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK? SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Reliability Data
Package Reliability	SC-70-6 (Cu)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.5 mm Pitch)
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For SC-89
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

RC Thermal Models
Si1051X-RC	RC Thermal Model for Si1051X
Si1051X_RC	R-C Thermal Model Parameters
Si1499DH-RC	RC Thermal Model for Si1499DH
Si3495DV-RC	RC Thermal Model for Si3495DV
Si3499DV-RC	RC Thermal Model for Si3499DV
Si5499DC-RC	RC Thermal Model for Si5499DC
Si8429DB-RC	RC Thermal Model for Si8429DB
Si8435DB-RC	RC Thermal Model for Si8435DB
Si8441DB-RC	RC Thermal Model for Si8441DB
Si8445DB-RC	RC Thermal Model for Si8445DB
Si8445DB_RC	R-C Thermal Model Parameters
Si8451DB-RC	RC Thermal Model for Si8451DB
Si8451DB_RC	R-C Thermal Model Parameters
SiA411DJ-RC	RC Thermal Model for SiA411DJ
SiA413DJ-RC	RC Thermal Model for SiA413DJ
SiA417DJ-RC	RC Thermal Model for SiA417DJ
SiA419DJ-RC	RC Thermal Model for SiA419DJ
SiB417DK-RC	RC Thermal Model for SiB417DK
SiB417DK_RC	R-C Thermal Model Parameters
SiB417EDK-RC	RC Thermal Model for SiB417EDK
SiB417EDK_RC	R-C Thermal Model Parameters

Tape Info
90-2377-1	Tape Drawing for SC-89 6L (TO-563) Flat
93-2345-x	Tape Drawing for TSOP-6
93-2346-x	Tape Drawing for ChipFET (1206-8)
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5241-x	Tape Drawing for PowerPAK SC-75
93-5257-X	Tape Drawing for MICRO FOOT 2x3, 0.5 mm Pitch, 0.25 Bump Height
93-5258-X	Tape Drawing for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-11	Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si1499DH-H Si3495DV-H Si3499DV-H Si5499DC-H Si8429DB-H Si8435DB-H Si8441DB-H Si8445DB-H Si8451DB-H SiA411DJ-H SiA413DJ-H SiA417DJ-H SiA419DJ-H SiB417DK-H	Si1499DH-P Si3495DV-P Si3499DV-P Si5499DC-P Si8429DB-P Si8435DB-P Si8441DB-P Si8445DB-P Si8451DB-P SiA411DJ-P SiA413DJ-P SiA417DJ-P SiA419DJ-P SiB417DK-P	Si1454DH-P OLB Si1499DH-P OLB Si3495DV-P OLB Si3499DV-P OLB Si5499DC-P OLB Si8429DB-P OLB Si8435DB-P OLB Si8441DB-P OLB Si8445DB-P OLB Si8451DB-P OLB SiA411DJ-P OLB SiA413DJ-P OLB SiA417DJ-P OLB SiA419DJ-P OLB SiB417DK-P OLB	Si1499DH-P LIB Si3495DV-P LIB Si3499DV-P LIB Si5499DC-P LIB Si8429DB-P LIB Si8435DB-P LIB Si8441DB-P LIB Si8445DB-P LIB Si8451DB-P LIB SiA411DJ-P LIB SiA413DJ-P LIB SiA417DJ-P LIB SiA419DJ-P LIB SiB417DK-P LIB	Si1499DH-DS Si3495DV-DS Si3499DV-DS Si5499DC-DS Si8429DB-DS Si8435DB-DS Si8441DB-DS Si8445DB-DS Si8451DB-DS SiA411DJ-DS SiA413DJ-DS SiA417DJ-DS SiA419DJ-DS

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