FEATURES

Leadframe and plastic encapsulation construction       Provides better die protection and reliability       Easier manufacturing handling       Fixed footprint and pad layout independent of die size across range of family Multiple Sources Available Top (1 °C/W) and bottom (1 °C/W) cooling provides dual heat dissipation paths for forced air applications Up to 48% lower on-resistance and up to 12% lower on-resistance x gate charge Easy to parallel devices, lowering inductance from board layouts Low parasitic inductance improves efficiency, especially at higher frequencies Double current density (>60 A) reduces space and cost Same footprint area as SO-8 0.8 mm profile, less than half of SO-8

APPLICATIONS
VRM modules for servers and workstations
Fixed telecom and data communication systems
      Oring
      Synchronous Rectification
      High current point-of-Load (POL)
Graphics cards

PolarPAK® Selector Guide