| PowerPAK SO-8 |
PowerPAK 1212-8 |
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INCREASE EFFICIENCY
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On-resistance as low as 2 mΩ
On-resistance x gate-charge product as low as 115
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On-resistance as low as 11 mΩ
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INCREASE POWER WITHOUT INCREASING FOOTPRINT, HEIGHT, OR HEAT
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Maximum power possible in the SO-8 increases from 3 W to 5 W
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Maximum power possible in the TSSOP-8 increases from 2.4 W to 3.5 W
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REDUCE AREA AND HEIGHT FOR ULTRA-THIN AND LIGHTWEIGHT APPLICATIONS
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53% smaller footprint area and 55% thinner than the DPAK
39% thinner than the SO-8
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48% smaller footprint area and 11% thinner than the TSSOP-8
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REDUCE HEAT WITH LOWER THERMAL RESISTANCE IN A SIMILAR PACKAGE SIZE
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Pin-compatible to SO-8, with similar footprint size and decrease in thermal
resistance from 16°C/W to <1°/W
Same thermal resistance as DPAK
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Thermal resistance decrease from 34°C/W to <2°C/W in the TSSOP-8 with smaller
footprint and thinner profile
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