Markings (1)
  Pad Guidlines (2)
  Package Drawing (2)
  Reliability Data (4)
  Reel Info (2)
  RC Thermal Models (9)
  Tape Info (4)
  SPICE (9)

Markings
PART MARKING	TO-252 (DPAK), TO-251

Pad Guidlines
AN826 - DPAK (TO-252)	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

Package Drawing
5346	TO-251 (IPAK)
5347	TO-252 (DPAK)

Reliability Data
Package Reliability	Environmental and Package Testing Data For TO-251/252 and Reverse TO-252 (DPAK)
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
93-5211-x	LOK Reel
Reel Information	LOK REEL

RC Thermal Models
SUD50N04-06P-RC	RC Thermal Model for SUD50N04-06P
SUD50N04-13P-RC	RC Thermal Model for SUD50N04-13P
SUD50N04-16P-RC	RC Thermal Model for SUD50N04-16P
SUD50N04-25P-RC	RC Thermal Model for SUD50N04-25P
SUD50N10-18P-RC	RC Thermal Model for SUD50N10-18P
SUD50P04-23-RC	RC Thermal Model for SUD50P04-23
SUU50N04-16P-RC	RC Thermal Model for SUU50N04-16P
SUU50N10-18P-RC	RC Thermal Model for SUU50N10-18P
SUU_SUD50N10-18P_RC	R-C Thermal Model Parameters

Tape Info
90-2339-1	Tape Drawing for TO-252 (DPAK) (T1 Method)
90-2369-x	Tape Drawing for TO-252 (DPAK) (T4 Method)
PACK-0020-	Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)
PACK-0020-	Device Orientation for TO-252 and Reverse TO-252 (T4)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
SUD50N04-06P-H	SUD50N04-06P-P	SUD50N04-06P-P OLB	SUD50N04-06P-P LIB	SUD50N04-06P-DS  SUD50N04-13P-DS  SUD50N04-16P-DS  SUD50N04-25P-DS  SUD50P04-23-DS