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Industry-best performance in a package with advanced thermal conductivity
On-resistance as low as 2.5 mΩ
Pin-compatible to SO-8, with decrease in thermal resistance from 16 °C/W to <1 °C/W
Leadless package can dissipate power up to a maximum of 5.4 W at 25 °C, about 50% more than the standard SO-8 devices in the same footprint
39% thinner than standard SO-8
May be used in many applications to replace DPAK power MOSFETs with a device requiring only half as much space on the PCB
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