Application Note (1)
  Markings (5)
  Pad Guidlines (20)
  Package Drawing (8)
  Reliability Data (17)
  Reel Info (1)
  Technical Note (3)
  RC Thermal Models (18)
  Tape Info (13)
  SPICE (75)

Application Note
AN818	Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET

Markings
PART MARKING	TO-252 (DPAK), TO-251
PART MARKING	PowerPAK SO-8, PowerPAK 1212-8
PART MARKING	TSSOP-8
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	SO-8

Pad Guidlines
AN1001	LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO
AN806	Mounting LITTLE FOOT TSSOP-8 Power MOSFETs
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN812	Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN822	PowerPAK 1212 Mounting and Thermal Considerations
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK 1212-8 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC70 Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SO-8 Dual	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - TSSOP-8	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc70-6L Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? SO-8 Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSSOP-8

Package Drawing
5498	SOIC-8 (Narrow)
5547	ChipFET (1206-8)
5844	TSSOP 8L
5934	PowerPAK SC70-6L
5940	PowerPAK ChipFET Dual Pad
5956	TO-252-4L
Package Information	PowerPAK? SO-8, (Single/Dual)
Package Information	PowerPAK? 1212, (Single/Dual)

Reliability Data
Document No. 74429
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For TSSOP 8 Lead
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212
Package Reliability	Environmental and Package Testing Data For PowerPAK SO-8
Package Reliability	PowerPAK SO-8
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Technical Note
Specification Comparison:	Si4500BDY vs. Si4500DY
Specification Comparison:	Si4501ADY vs. Si4501DY
Specification Comparison:	Si6544BDQ vs. Si6544DQ

RC Thermal Models
Si4500BDY-RC	RC Thermal Model for Si4500BDY
Si4501ADY-RC	RC Thermal Model for Si4501ADY
Si4511DY-RC	RC Thermal Model for Si4511DY
Si4561DY-RC	RC Thermal Model for Si4561DY
Si4563DY-RC	RC Thermal Model for Si4563DY
Si4565DY-RC	RC Thermal Model for Si4565DY
Si4569DY-RC	RC Thermal Model for Si4569DY
Si5515CDC-RC	RC Thermal Model for Si5515CDC
Si5515CDC_RC	R-C Thermal Model Parameters
Si5517DU-RC	RC Thermal Model for Si5517DU
Si5519DU-RC	RC Thermal Model for Si5519DU
Si6544BDQ-RC	RC Thermal Model for Si6544BDQ
Si6562DQ-RC	RC Thermal Model for Si6562DQ
Si7501DN-RC	RC Thermal Model for Si7501DN
Si7540DP-RC	RC Thermal Model for Si7540DP
SiA511DJ-RC	RC Thermal Model for SiA511DJ
SUD50NP04-77P-RC	RC Thermal Model for SUD50NP04-77P
SUD50NP04-77P_RC	R-C Thermal Model Parameters

Tape Info
90-2345-x	Tape Drawing for TSSOP-8 (16 mm)
90-2369-x	Tape Drawing for TO-252 (DPAK) (T4 Method)
90-2378-1	Tape Drawing for PowerPAK SO-8
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
93-2346-x	Tape Drawing for ChipFET (1206-8)
93-5240-x	Tape Drawing for PowerPAK SC-70
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0020-	Device Orientation for TO-252 and Reverse TO-252 (T4)
Tape Information	PowerPAK? 1212

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si4500BDY-H  Si4501ADY-H  Si4511DY-H  Si4561DY-H  Si4563DY-H  Si4565DY-H  Si4569DY-H  Si5517DU-H  Si5519DU-H  Si6544BDQ-H  Si6562DQ-H  Si7501DN-H  Si7540DP-H  SiA511DJ-H  SUD50NP04-77P-H	Si4500BDY-P  Si4501ADY-P  Si4511DY-P  Si4561DY-P  Si4563DY-P  Si4565DY-P  Si4569DY-P  Si5517DU-P  Si5519DU-P  Si6544BDQ-P  Si6562DQ-P  Si7501DN-P  Si7540DP-P  SiA511DJ-P  SUD50NP04-77P-P	Si4500BDY-P OLB  Si4501ADY-P OLB  Si4511DY-P OLB  Si4561DY-P OLB  Si4563DY-P OLB  Si4565DY-P OLB  Si4569DY-P OLB  Si5517DU-P OLB  Si5519DU-P OLB  Si6544BDQ-P OLB  Si6562DQ-P OLB  Si7501DN-P OLB  Si7540DP-P OLB  SiA511DJ-P OLB  SUD50NP04-77P-P OLB	Si4500BDY-P LIB  Si4501ADY-P LIB  Si4511DY-P LIB  Si4561DY-P LIB  Si4563DY-P LIB  Si4565DY-P LIB  Si4569DY-P LIB  Si5517DU-P LIB  Si5519DU-P LIB  Si6544BDQ-P LIB  Si6562DQ-P LIB  Si7501DN-P LIB  Si7540DP-P LIB  SiA511DJ-P LIB  SUD50NP04-77P-P LIB	Si4500BDY-DS  Si4501ADY-DS  Si4511DY-DS  Si4561DY-DS  Si4563DY-DS  Si4565DY-DS  Si4569DY-DS  Si5517DU-DS  Si5519DU-DS  Si6544BDQ-DS  Si6562DQ-DS  Si7501DN-DS  Si7540DP-DS  SiA511DJ-DS  SUD50NP04-77P-DS