Application Note (1)
  Markings (7)
  Pad Guidlines (21)
  Package Drawing (8)
  Reliability Data (17)
  Reel Info (1)
  Technical Note (2)
  RC Thermal Models (12)
  Tape Info (15)
  SPICE (40)

Application Note
AN818	Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET

Markings
PART MARKING	TO-252 (DPAK), TO-251
PART MARKING	PowerPAK SO-8, PowerPAK 1212-8
PART MARKING	TSSOP-8
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	TSOP-5/6
PART MARKING	SO-8
PART MARKING	SOT-23

Pad Guidlines
AN1001	LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO
AN806	Mounting LITTLE FOOT TSSOP-8 Power MOSFETs
AN807	Mounting LITTLE FOOT SOT-23 Power MOSFETs
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN812	Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN822	PowerPAK 1212 Mounting and Thermal Considerations
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - DPAK (TO-252)	Recommended Minimum PAD Pattern
AN826 - PowerPAK 1212-8 Single	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - SOT-23	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
AN826 - TSSOP-8	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR SoT-23
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSSOP-8

Package Drawing
5347	TO-252 (DPAK)
5479	TO-236 (SOT-23)
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5844	TSSOP 8L
5956	TO-252-4L
Package Information	PowerPAK? 1212, (Single/Dual)

Reliability Data
Document No. 74429
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For TSSOP 8 Lead
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212
Package Reliability	Environmental and Package Testing Data For SSOT-23
Package Reliability	SSOT-23
Package Reliability	Environmental and Package Testing Data For TO-251/252 and Reverse TO-252 (DPAK)
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Technical Note
Document No. 69567
Specification Comparison	Si3454CDV vs. Si3454ADV

RC Thermal Models
Si2316BDS-RC	RC Thermal Model for Si2316BDS
Si2316BDS_RC	R-C Thermal Model Parameters
Si4488DY-RC	RC Thermal Model for Si4488DY
Si4906DY-RC	RC Thermal Model for Si4906DY
Si5515CDC-RC	RC Thermal Model for Si5515CDC
Si5515CDC_RC	R-C Thermal Model Parameters
Si6562DQ-RC	RC Thermal Model for Si6562DQ
Si6928DQ-RC	RC Thermal Model for Si6928DQ
Si7501DN-RC	RC Thermal Model for Si7501DN
SUD50NP04-77P-RC	RC Thermal Model for SUD50NP04-77P
SUD50NP04-77P_RC	R-C Thermal Model Parameters
SUD50P04-40P-RC	RC Thermal Model for SUD50P04-40P

Tape Info
90-2339-1	Tape Drawing for TO-252 (DPAK) (T1 Method)
90-2345-x	Tape Drawing for TSSOP-8 (16 mm)
90-2369-x	Tape Drawing for TO-252 (DPAK) (T4 Method)
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
91-5209-x	Tape Drawing for SOT-23 (T1 and T2 Methods)
93-2345-x	Tape Drawing for TSOP-6
93-2346-x	Tape Drawing for ChipFET (1206-8)
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-2	Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0020-	Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1)
PACK-0020-	Device Orientation for TO-252 and Reverse TO-252 (T4)
Tape Information	PowerPAK? 1212

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si2316BDS-H  Si4488DY-H  Si4906DY-H  Si6562DQ-H  Si6928DQ-H  Si7501DN-H  SUD50NP04-77P-H  SUD50P04-40P-H	Si2316BDS-P  Si4488DY-P  Si4906DY-P  Si6562DQ-P  Si6928DQ-P  Si7501DN-P  SUD50NP04-77P-P  SUD50P04-40P-P	Si2316BDS-P OLB  Si4488DY-P OLB  Si4906DY-P OLB  Si6562DQ-P OLB  Si6928DQ-P OLB  Si7501DN-P OLB  SUD50NP04-77P-P OLB  SUD50P04-40P-P OLB	Si2316BDS-P LIB  Si4488DY-P LIB  Si4906DY-P LIB  Si6562DQ-P LIB  Si6928DQ-P LIB  Si7501DN-P LIB  SUD50NP04-77P-P LIB  SUD50P04-40P-P LIB	Si2316BDS-DS  Si4488DY-DS  Si4906DY-DS  Si6562DQ-DS  Si6928DQ-DS  Si7501DN-DS  SUD50NP04-77P-DS  SUD50P04-40P-DS