Markings (2)
  Pad Guidlines (8)
  Package Drawing (3)
  Reliability Data (7)
  Reel Info (1)
  RC Thermal Models (14)
  Tape Info (13)
  SPICE (45)

Markings
PART MARKING	MICRO FOOT Devices
PART MARKING	SC-70 for Si Part Numbers

Pad Guidlines
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - PowerPAK SC70 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC75 Single	Recommended Minimum PAD Pattern
AN826 - SC-70: 6-Lead	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK? SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc75-6L Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead

Package Drawing
5550	SC-70 6L
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L

Reliability Data
Package Reliability	SC-70-6 (Cu)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.5 mm Pitch)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si1499DH-RC	RC Thermal Model for Si1499DH
Si8424DB-RC	RC Thermal Model for Si8424DB
Si8429DB-RC	RC Thermal Model for Si8429DB
Si8441DB-RC	RC Thermal Model for Si8441DB
Si8445DB-RC	RC Thermal Model for Si8445DB
Si8445DB_RC	R-C Thermal Model Parameters
SiA417DJ-RC	RC Thermal Model for SiA417DJ
SiA419DJ-RC	RC Thermal Model for SiA419DJ
SiB414DK-RC	RC Thermal Model for SiB414DK
SiB414DK_RC	R-C Thermal Model Parameters
SiB417DK-RC	RC Thermal Model for SiB417DK
SiB417DK_RC	R-C Thermal Model Parameters
SiB417EDK-RC	RC Thermal Model for SiB417EDK
SiB417EDK_RC	R-C Thermal Model Parameters

Tape Info
93-5213-1	Tape Drawing for SC-70 5L/6L
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5241-x	Tape Drawing for PowerPAK SC-75
93-5257-X	Tape Drawing for MICRO FOOT 2x3, 0.5 mm Pitch, 0.25 Bump Height
93-5258-X	Tape Drawing for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-11	Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si1499DH-H  Si8424DB-H  Si8429DB-H  Si8441DB-H  Si8445DB-H  SiA417DJ-H  SiA419DJ-H  SiB414DK-H  SiB417DK-H	Si1499DH-P  Si8424DB-P  Si8429DB-P  Si8441DB-P  Si8445DB-P  SiA417DJ-P  SiA419DJ-P  SiB414DK-P  SiB417DK-P	Si1454DH-P OLB  Si1499DH-P OLB  Si8424DB-P OLB  Si8429DB-P OLB  Si8441DB-P OLB  Si8445DB-P OLB  SiA417DJ-P OLB  SiA419DJ-P OLB  SiB414DK-P OLB  SiB417DK-P OLB	Si1499DH-P LIB  Si8424DB-P LIB  Si8429DB-P LIB  Si8441DB-P LIB  Si8445DB-P LIB  SiA417DJ-P LIB  SiA419DJ-P LIB  SiB414DK-P LIB  SiB417DK-P LIB	Si1499DH-DS  Si8424DB-DS  Si8429DB-DS  Si8441DB-DS  Si8445DB-DS  SiA417DJ-DS  SiA419DJ-DS  SiB414DK-DS