Related Documents - Vishay MOSFETs, On-resistance 20 mOhms and below, Drain-to-source voltage < -6V to -20 V

Related Documents

  Markings (3)
  Pad Guidlines (13)
  Package Drawing (4)
  Reliability Data (9)
  Reel Info (1)
  Technical Note (6)
  RC Thermal Models (17)
  Tape Info (6)
  SPICE (70)

Pad Guidlines
AN1001	LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO
AN806	Mounting LITTLE FOOT TSSOP-8 Power MOSFETs
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN822	PowerPAK 1212 Mounting and Thermal Considerations
AN826 - PowerPAK 1212-8 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK SO-8 Single	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - TSSOP-8	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? SO-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSSOP-8

Reliability Data
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For TSSOP 8 Lead
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212 Solder Process
Package Reliability	Environmental and Package Testing Data For PowerPAK SO-8
Package Reliability	PowerPAK SO-8
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Technical Note
Document No. 74229
Document No. 74278
Specification Comparison:	Si4403BDY vs. Si4403DY
Specification Comparison:	Si6463BDQ vs. Si6463ADQ
Specification Comparison:	Si6467BDQ vs. Si6467DQ
Specification Comparison:	Si4463BDY vs. Si4463DY

RC Thermal Models
Si4403BDY-RC	RC Thermal Model for Si4403BDY
Si4423DY-RC	RC Thermal Model for Si4423DY
Si4463BDY-RC	RC Thermal Model for Si4463BDY
Si4465ADY-RC	RC Thermal Model for Si4465ADY
Si4913DY-RC	RC Thermal Model for Si4913DY
Si4931DY-RC	RC Thermal Model for Si4931DY
Si4943CDY-RC	RC Thermal Model for Si4943CDY
Si4943CDY_RC	R-C Thermal Model Parameters
Si6423DQ-RC	RC Thermal Model for Si6423DQ
Si6463BDQ-RC	RC Thermal Model for Si6463BDQ
Si6467BDQ-RC	RC Thermal Model for Si6467BDQ
Si7107DN-RC	RC Thermal Model for Si7107DN
Si7411DN-RC	RC Thermal Model for Si7411DN
Si7413DN-RC	RC Thermal Model for Si7413DN
Si7485DP-RC	RC Thermal Model for Si7485DP
Si7601DN-RC	RC Thermal Model for Si7601DN
Si7601DN_RC	R-C Thermal Model Parameters

Tape Info
90-2345-x	Tape Drawing for TSSOP-8 (16 mm)
90-2378-1	Tape Drawing for PowerPAK SO-8
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
Tape Information	PowerPAK? 1212

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si4403BDY-H Si4423DY-H Si4463BDY-H Si4465ADY-H Si4913DY-H Si4931DY-H Si6423DQ-H Si6463BDQ-H Si6467BDQ-H Si7107DN-H Si7411DN-H SI7413DN-H Si7485DP-H Si7601DN-H	Si4403BDY-P Si4423DY-P Si4463BDY-P Si4465ADY-P Si4913DY-P Si4931DY-P Si6423DQ-P Si6463BDQ-P Si6467BDQ-P Si7107DN-P Si7411DN-P SI7413DN-P Si7485DP-P Si7601DN-P	Si4403BDY-P OLB Si4423DY-P OLB Si4463BDY-P OLB Si4465ADY-P OLB Si4913DY-P OLB Si4931DY-P OLB Si6423DQ-P OLB Si6463BDQ-P OLB Si6467BDQ-P OLB Si7107DN-P OLB Si7411DN-P OLB SI7413DN-P OLB Si7485DP-P OLB Si7601DN-P OLB	Si4403BDY-P LIB Si4423DY-P LIB Si4463BDY-P LIB Si4465ADY-P LIB Si4913DY-P LIB Si4931DY-P LIB Si6423DQ-P LIB Si6463BDQ-P LIB Si6467BDQ-P LIB Si7107DN-P LIB Si7411DN-P LIB SI7413DN-P LIB Si7485DP-P LIB Si7601DN-P LIB	Si4403BDY-DS Si4423DY-DS Si4463BDY-DS Si4465ADY-DS Si4913DY-DS Si4931DY-DS Si6423DQ-DS Si6463BDQ-DS Si6467BDQ-DS Si7107DN-DS Si7411DN-DS SI7413DN-DS Si7485DP-DS Si7601DN-DS

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