Related Documents - 1.2 V rated on-resistance
General Information (1)
Markings (3)
Package Drawings (5)
Pad Guidelines (7)
RC Thermal Models (12)
Reel Info (1)
Reliability Data (9)
Tape Info (15)
SPICE (50)
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
MICRO FOOT Devices |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SOT-23 |
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Package Drawings
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5479 |
TO-236 (SOT-23) |
5550 |
SC-70 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
Package Information |
Case Outline for Thin PPAK SC75 Single |
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Pad Guidelines
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AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAKŪ SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAKŪ Sc75-6L Single |
PAD Pattern |
MICRO FOOT Products |
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RC Thermal Models
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Si1489EDH_RC |
R-C Thermal Model Parameters |
Si2329DS-GE3_RC |
R-C Thermal Model Parameters |
Si2342DS_RC |
R-C Thermal Model Parameters |
Si8416DB_RC |
R-C Thermal Model Parameters |
Si8424DB-RC |
RC Thermal Model for Si8424DB |
Si8429DB-RC |
RC Thermal Model for Si8429DB |
Si8469DB_RC |
R-C Thermal Model Parameters |
Si8802DB_RC |
R-C Thermal Model Parameters |
SiA419DJ-RC |
RC Thermal Model for SiA419DJ |
SiA427DJ_RC |
R-C Thermal Model Parameters |
SiB404DK_RC |
R-C Thermal Model Parameters |
SiB437EDKT_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for MICRO FOOTŪ |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SC-75 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
Device Orientation |
Device Orientation for PowerPAK SC-70 |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-21 |
Device Orientation PowerPAKŪ SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-11 |
Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2) |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOTŪ 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOTŪ 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAKŪ SC-75 AND THIN PowerPAK SC-75 |
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General Information
Si2329DS-H

