Related Documents - TrenchFET® Gen III P-Channel

  Application Notes (1)
  General Information (1)
  Markings (6)
  Package Drawings (8)
  Pad Guidelines (15)
  RC Thermal Models (18)
  Reel Info (1)
  Reliability Data (11)
  Tape Info (17)
  SPICE (74)

Application Notes [top]
AN818	Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET

General Information [top]
General Information	Useful Links

Markings [top]
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	MICRO FOOT Devices
PART MARKING	SC-70 for Si Part Numbers
PART MARKING	SO-8
PART MARKING	TSOP-5/6
Part Marking Information	devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7

Package Drawings [top]
5498	SOIC-8 (Narrow)
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5550	SC-70 6L
5934	PowerPAK SC70-6L
5935	PowerPAK SC75-6L
Package Information	PowerPAK® 1212, (Single/Dual)
Package Information	PowerPAK® SO-8, (Single/Dual)

Pad Guidelines [top]
AN811	Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance
AN815	Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance
AN821	PowerPAK SO-8 Mounting and Thermal Considerations
AN822	PowerPAK 1212 Mounting and Thermal Considerations
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET®
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single
PAD Pattern	LITTLE FOOT SO-8 Power MOSFETs
PAD Pattern	LITTLE FOOT TSOP-6 Power MOSFETs
PAD Pattern	MICRO FOOT Products
PAD Pattern	SO-8
PAD Pattern	TSOP-6

RC Thermal Models [top]
Si1401EDH_RC	R-C Thermal Model Parameters
Si1441EDH_RC	R-C Thermal Model Parameters
Si1443EDH-GE3_RC	R-C Thermal Model Parameters
Si3477DV_RC	R-C Thermal Model Parameters
Si4497DY_RC	R-C Thermal Model Parameters
Si5471DC-RC	RC Thermal Model for Si5471DC
Si5471DC_RC	R-C Thermal Model Parameters
Si7137DP-RC	RC Thermal Model for Si7137DP
Si7137DP_RC	R-C Thermal Model Parameters
Si7141DP_RC	R-C Thermal Model Parameters
Si7145DP-RC	RC Thermal Model for Si7145DP
Si7145DP_RC	R-C Thermal Model Parameters
Si7615DN_RC	R-C Thermal Model Parameters
Si7625DN-DS	SPICE datasheet
Si7625DN_RC	R-C Thermal Model Parameters
Si7629DN_RC	R-C Thermal Model Parameters
Si8497DB_RC	R-C Thermal Model Parameters
Si8499DB_RC	R-C Thermal Model Parameters
SiA433EDJ_RC	R-C Thermal Model Parameters
SiB455EDK_RC	R-C Thermal Model Parameters
SiB457EDK-RC	RC Thermal Model for SiB457EDK
SiS902DN-RC	RC Thermal Model for SiS902DN
SiS902DN_RC	R-C Thermal Model Parameters

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Document No.69616
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212 Solder Process
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-75
Package Reliability	Environmental and Package Testing Data For PowerPAK SO-8 Solder Process
Package Reliability	Environmental and Package Testing Data For SOIC-8 Solder Process
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	SC-70-6 (Cu)
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Tape Info [top]
91-5209-x	Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY)
93-2345-X	TSOP: 5/6-Lead (SC-59)
93-5213-X	SC-70 3-LEADS (T2-METHOD)
Device Orientation-MICRO FOOT® Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
Tape Information	1206-8 ChipFET®
Tape Information	MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
Tape Information	MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT
Tape Information	PowerPAK® 1212
Tape Information	PowerPAK® SC-70 AND THIN PowerPAK SC-70
Tape Information	PowerPAK® SC-75 AND THIN PowerPAK SC-75
Tape Information	PowerPAK® SOIC-8

SPICE [top]
H-Spice Model	P-Spice Model (*.lib)	P-Spice Model (*.olb)	P-Spice Model (*.txt)	Spice Model (pdf)
Si3477DV-H Si4497DY-H Si5471DC-H Si7137DP-H Si7145DP-H Si7615DN-H Si7625DN-H Si7629DN-H Si8483DB-H Si8487DB-H Si8497DB-H Si8499DB-H SiA433EDJ-H SiB455EDK-H SiB457EDK-H	Si3477DV-P LIB Si4497DY-P LIB Si5471DC-P LIB Si7137DP-P LIB Si7145DP-P LIB Si7615DN-P LIB Si7625DN-P LIB Si7629DN-P LIB Si8483DB-P LIB Si8487DB-P LIB Si8497DB-P LIB Si8499DB-P LIB SiA433EDJ-P LIB SiB455EDK-P LIB SiB457EDK-P LIB	Si3477DV-P OLB Si4497DY-P OLB Si5471DC-P OLB Si7137DP-P OLB Si7145DP-P OLB Si7615DN-P OLB Si7625DN-P OLB Si7629DN-P OLB Si8483DB-P OLB Si8487DB-P OLB Si8497DB-P OLB Si8499DB-P OLB SiA433EDJ-P OLB SiB455EDK-P OLB SiB457EDK-P OLB	Si3477DV-P Si4497DY-P Si5471DC-P Si7137DP-P Si7145DP-P Si7615DN-P Si7625DN-P Si7629DN-P Si8483DB-P Si8487DB-P Si8497DB-P Si8499DB-P SiA433EDJ-P SiB455EDK-P SiB457EDK-P	Si3477DV-DS Si4497DY-DS Si5471DC-DS Si7137DP-DS Si7145DP-DS Si7615DN-DS Si7629DN-DS Si8483DB-DS Si8487DB-DS Si8497DB-DS Si8499DB-DS SiA433EDJ-DS SiB455EDK-DS SiB457EDK-DS