Related Documents - Drain-to-source voltage 5 V to 20 V
Application Notes (5)
General Information (1)
Markings (12)
Package Drawings (18)
Pad Guidelines (29)
RC Thermal Models (71)
Reel Info (1)
Reliability Data (27)
Tape Info (36)
Technical Notes (12)
SPICE (336)
|
Application Notes
|
|
AN610 |
PolarPAK Solder Joint Reliability Based On Thermal Fatigue |
AN611 |
Development of a Lead (Pb)-Free Soldering Process for PolarPAK |
AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
AN828 |
Working with PolarPAK In-Lab Soldering and Re-Working Recommendations |
AN829 |
PolarPAK Thermal Impedence (Rth) vs. Heat Sink Assembly Clamping Torque |
|
General Information
|
|
General Information |
Useful Links |
|
Markings
|
|
PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
PART MARKING |
MICRO FOOT Devices |
PART MARKING |
PolarPAK |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SO-8 |
PART MARKING |
SOT-23 |
PART MARKING |
TO-252 (DPAK), TO-251 |
PART MARKING |
TSOP-5/6 |
PART MARKING |
TSSOP-8 |
Part Marking Information |
devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
Part Marking Information |
devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5) |
Part Marking Information |
TO-252 (DPAK), TO251 |
|
Package Drawings
|
|
5479 |
TO-236 (SOT-23) |
5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5547 |
ChipFET (1206-8) |
5549 |
SC-70 3L |
5550 |
SC-70 6L |
5844 |
TSSOP 8L |
5869 |
SC-89 3L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
5947 |
PolarPAK (Option S) |
Package Information |
PowerPAK® 1212, (Single/Dual) |
Package Information |
PowerPAK® ChipFET® SINGLE PAD |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
Package Information |
SC-75A: 3-LEADS |
Package Information |
TO-252AA |
Package Information |
TO-263 (D2PAK): 3-LEAD |
|
Pad Guidelines
|
|
AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN811 |
Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN813 |
Single-Channel LITTLE FOOT SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PolarPAK® Option L and S |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-75A: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single |
PAD Pattern |
D2PAK |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
|
RC Thermal Models
|
|
Si1012CR_GE3_RC |
R-C Thermal Model Parameters |
Si1012R-RC |
RC Thermal Model for Si1012R |
Si1032R-RC |
RC Thermal Model for Si1032R |
Si1050X-RC |
RC Thermal Model for Si1050X |
Si1056X-RC |
RC Thermal Model for Si1056X |
Si1058X-RC |
RC Thermal Model for Si1058X |
Si1300BDL-RC |
RC Thermal Model for Si1300BDL |
Si1400DL-RC |
RC Thermal Model for Si1400DL |
Si1406DH-RC |
RC Thermal Model for Si1406DH |
Si1410EDH-RC |
RC Thermal Model for Si1410EDH |
Si1422DH_RC |
R-C Thermal Model Parameters |
Si1424EDH_RC |
R-C Thermal Model Parameters |
Si2302CDS-RC |
RC Thermal Model for Si2302CDS |
Si2302CDS_RC |
R-C Thermal Model Parameters |
Si2312CDS_RC |
R-C Thermal Model Parameters |
Si2342DS_RC |
R-C Thermal Model Parameters |
Si3442BDV-RC |
RC Thermal Model for Si3442BDV |
Si3460DDV_RC |
R-C Thermal Model Parameters |
Si3464DV_RC |
R-C Thermal Model Parameters |
Si4004DY_RC |
R-C Thermal Model Parameters |
Si4114DY-RC |
RC Thermal Model for Si4114DY |
Si4114DY_RC |
R-C Thermal Model Parameters |
Si4136DY-RC |
RC Thermal Model for Si4136DY |
Si4136DY_RC |
R-C Thermal Model Parameters |
Si4186DY-RC |
RC Thermal Model for Si4186DY |
Si4186DY_RC |
R-C Thermal Model Parameters |
Si4838BDY-RC |
RC Thermal Model for Si4838BDY |
Si4838BDY_RC |
R-C Thermal Model Parameters |
Si4866BDY-RC |
RC Thermal Model for Si4866BDY |
Si5406CDC-RC |
RC Thermal Model for Si5406CDC |
Si5406CDC_RC |
R-C Thermal Model Parameters |
Si5432DC-RC |
RC Thermal Model for Si5432DC |
Si5432DC_RC |
R-C Thermal Model Parameters |
Si5456DU-RC |
RC Thermal Model for Si5456DU |
Si5456DU_RC |
R-C Thermal Model Parameters |
Si5486DU-RC |
RC Thermal Model for Si5486DU |
Si6466ADQ-RC |
RC Thermal Model for Si6466ADQ |
Si7102DN-RC |
RC Thermal Model for Si7102DN |
Si7106DN-RC |
RC Thermal Model for Si7106DN |
Si7106DN_RC |
R-C Thermal Model Parameters |
Si7858BDP_RC |
R-C Thermal Model Parameters |
Si8402DB-RC |
RC Thermal Model for Si8402DB |
Si8416DB_RC |
R-C Thermal Model Parameters |
Si8424DB-RC |
RC Thermal Model for Si8424DB |
Si8472DB_RC |
R-C Thermal Model Parameters |
Si8800EDB_RC |
R-C Thermal Model Parameters |
Si8802DB_RC |
R-C Thermal Model Parameters |
SiA406DJ_RC |
R-C Thermal Model Parameters |
SiA426DJ-RC |
RC Thermal Model for SiA426DJ |
SiA426DJ_RC |
R-C Thermal Model Parameters |
SiA430DJ-RC |
RC Thermal Model for SiA430DJ |
SiA430DJ_RC |
R-C Thermal Model Parameters |
SiB404DK_RC |
R-C Thermal Model Parameters |
SiB406EDK_RC |
R-C Thermal Model Parameters |
SiB422EDK_RC |
R-C Thermal Model Parameters |
SiB488DK_RC |
R-C Thermal Model Parameters |
SiE820DF-RC |
RC Thermal Model for SiE820DF |
SiE822DF-RC |
RC Thermal Model for SiE822DF |
SiR404DP-RC |
RC Thermal Model for SiR404DP |
SiR404DP_RC |
R-C Thermal Model Parameters |
SiR410DP-RC |
RC Thermal Model for SiR410DP |
SiR410DP_RC |
R-C Thermal Model Parameters |
SiR424DP_RC |
R-C Thermal Model Parameters |
SiR440DP-RC |
RC Thermal Model for SiR440DP |
SiR440DP_RC |
R-C Thermal Model Parameters |
SiR484DP-RC |
RC Thermal Model for SiR484DP |
SiR484DP_RC |
R-C Thermal Model Parameters |
SiR492DP-RC |
RC Thermal Model for SiR492DP |
SiR492DP_RC |
R-C Thermal Model Parameters |
SiR494DP-RC |
RC Thermal Model for SiR494DP |
SiR494DP_RC |
R-C Thermal Model Parameters |
SiR496DP-RC |
RC Thermal Model for SiR496DP |
SiR496DP_RC |
R-C Thermal Model Parameters |
SiR800DP_RC |
R-C Thermal Model Parameters |
SiR802DP_RC |
R-C Thermal Model Parameters |
SiR866DP-RC |
RC Thermal Model for SiR866DP |
SiR866DP_RC |
R-C Thermal Model Parameters |
SiR890DP-RC |
RC Thermal Model for SiR890DP |
SiR890DP_RC |
R-C Thermal Model Parameters |
SiS376DN_RC |
R-C Thermal Model Parameters |
SiS410DN-RC |
RC Thermal Model for SiS410DN |
SiS410DN_RC |
R-C Thermal Model Parameters |
SiS424DN-RC |
RC Thermal Model for SiS424DN |
SiS424DN_RC |
R-C Thermal Model Parameters |
SiS426DN-RC |
RC Thermal Model for SiS426DN |
SiS426DN_RC |
R-C Thermal Model Parameters |
SiS438DN-RC |
RC Thermal Model for SiS438DN |
SiS438DN_RC |
R-C Thermal Model Parameters |
SiS454DN_RC |
R-C Thermal Model Parameters |
SUD50N02-06P-RC |
RC Thermal Model for SUD50N02-06P |
SUD50N02-09P-RC |
RC Thermal Model for SUD50N02-09P |
SUM40N02-12P-RC |
RC Thermal Model for SUM40N02-12P |
SUM60N02-3m9P-RC |
RC Thermal Model for SUM60N02-3m9P |
SUM60N02-3m9P_RC |
R-C Thermal Model Parameters |
TN0200K-RC |
RC Thermal Model for TN0200K |
TN0200K_RC |
R-C Thermal Model Parameters |
TN0201K-RC |
RC Thermal Model for TN0201K |
TN0201K_TN0201KL_RC |
R-C Thermal Model Parameters |
TN0201KL-RC |
RC Thermal Model for TN0201KL |
|
Reel Info
|
|
Reel Information |
Lok Reel |
|
Reliability Data
|
|
Package Reliability |
Environmental and Package Testing Data for ChipFET® (1206-8) |
Package Reliability |
Environmental and Package Testing Data for D2PAK, TO-263 |
Package Reliability |
Environmental and Package Testing Data for DPAK, TO-252, TO-251 |
Package Reliability |
Environmental and Package Testing Data for MICRO FOOT® |
Package Reliability |
Environmental and Package Testing Data For PolarPAK |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® 1212-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-75 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SC-70 |
Package Reliability |
Environmental and Package Testing Data for SC-75A |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SOT-23 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
|
Tape Info
|
|
90-2339-1 |
Tape Drawing for TO-252 (DPAK) (T1 Method) |
90-2342-x |
TO-263 (D2PAK): 3- and 5-lead |
90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
90-2369-x |
Tape Drawing for TO-252 (DPAK) (T4 Method) |
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
93-5217-1 |
Tape Drawing for SC-75A 3L |
93-5217-1 |
Tape Drawing for SC-89 3L |
Device Orientation-MICRO FOOT® Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOT® Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-21 |
Device Orientation for PolarPAK (T1) |
PACK-0007-21 |
Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0020- |
Device Orientation for TO-252 and Reverse TO-252 (T4) |
PACK-0020- |
Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1) |
PACK-0020- |
Device Orientation for TO-263 (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-11 |
Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2) |
Tape Information |
1206-8 ChipFET® |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
Tape Information |
PolarPAK® Carrier Tape |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAK® 1212 |
Tape Information |
PowerPAK® ChipFET® |
Tape Information |
PowerPAK® SC-75 AND THIN PowerPAK SC-75 |
Tape Information |
PowerPAK® SOIC-8 |
Tape Information |
SC-70 3-LEADS (T1-METHOD) |
|
Technical Notes
|
|
Document No.74232 |
|
Specification Comparison |
Si1012CR vs. Si1012R |
Specification Comparison |
Si1300BDL vs. Si1300DL |
Specification Comparison |
Si2302CDS vs. Si2302ADS |
Specification Comparison |
Si2312CDS vs. Si2312BDS |
Specification Comparison |
Si3460DDV vs. Si3460BDV |
Specification Comparison |
Si4838BDY vs. Si4838DY |
Specification Comparison |
Si4866BDY vs. Si4866DY |
Specification Comparison |
Si5406CDC vs. Si5406DC |
Specification Comparison |
Si7858BDP vs. Si7858ADP |
Specification Comparison: |
Si3442BDV vs. Si3442DV |
Specification Comparison: |
TN0200K vs. TN0200T |
Useful Links
- Service and Support
- Product Information
- Featured Products



AN610
Si1012CR-H

