Related Documents - MICRO FOOT package
General Information (1)
Markings (1)
Pad Guidelines (1)
RC Thermal Models (18)
Reel Info (1)
Reliability Data (6)
Tape Info (9)
SPICE (90)
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
MICRO FOOT Devices |
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Pad Guidelines
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PAD Pattern |
MICRO FOOT Products |
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RC Thermal Models
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Si8402DB-RC |
RC Thermal Model for Si8402DB |
Si8407DB-RC |
RC Thermal Model for Si8407DB |
Si8409DB-RC |
RC Thermal Model for Si8409DB |
Si8413DB-RC |
RC Thermal Model for Si8413DB |
Si8415DB-RC |
RC Thermal Model for Si8415DB |
Si8416DB_RC |
R-C Thermal Model Parameters |
Si8424DB-RC |
RC Thermal Model for Si8424DB |
Si8429DB-RC |
RC Thermal Model for Si8429DB |
Si8461DB-RC |
RC Thermal Model for Si8461DB |
Si8461DB_RC |
R-C Thermal Model Parameters |
Si8467DB_RC |
R-C Thermal Model Parameters |
Si8469DB_RC |
R-C Thermal Model Parameters |
Si8472DB_RC |
R-C Thermal Model Parameters |
Si8473EDB_RC |
R-C Thermal Model Parameters |
Si8497DB_RC |
R-C Thermal Model Parameters |
Si8499DB_RC |
R-C Thermal Model Parameters |
Si8800EDB_RC |
R-C Thermal Model Parameters |
Si8802DB_RC |
R-C Thermal Model Parameters |
Si8809EDB_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for MICRO FOOTŪ |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOTŪ Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-11 |
Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-3 |
Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2) |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOTŪ 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOTŪ 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICRO FOOTŪ 2 x 3: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8407DB-T2, Si8902EDB-T2) |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
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General Information
Si8402DB-H

