Related Documents - MICRO FOOT package

  General Information (1)
  Markings (1)
  Pad Guidelines (1)
  RC Thermal Models (18)
  Reel Info (1)
  Reliability Data (6)
  Tape Info (9)
  SPICE (90)

General Information [top]
General Information	Useful Links

Markings [top]
PART MARKING	MICRO FOOT Devices

Pad Guidelines [top]
PAD Pattern	MICRO FOOT Products

RC Thermal Models [top]
Si8402DB-RC	RC Thermal Model for Si8402DB
Si8407DB-RC	RC Thermal Model for Si8407DB
Si8409DB-RC	RC Thermal Model for Si8409DB
Si8413DB-RC	RC Thermal Model for Si8413DB
Si8415DB-RC	RC Thermal Model for Si8415DB
Si8416DB_RC	R-C Thermal Model Parameters
Si8424DB-RC	RC Thermal Model for Si8424DB
Si8429DB-RC	RC Thermal Model for Si8429DB
Si8461DB-RC	RC Thermal Model for Si8461DB
Si8461DB_RC	R-C Thermal Model Parameters
Si8467DB_RC	R-C Thermal Model Parameters
Si8469DB_RC	R-C Thermal Model Parameters
Si8472DB_RC	R-C Thermal Model Parameters
Si8473EDB_RC	R-C Thermal Model Parameters
Si8497DB_RC	R-C Thermal Model Parameters
Si8499DB_RC	R-C Thermal Model Parameters
Si8800EDB_RC	R-C Thermal Model Parameters
Si8802DB_RC	R-C Thermal Model Parameters
Si8809EDB_RC	R-C Thermal Model Parameters

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data for MICRO FOOT®
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Tape Info [top]
Device Orientation-MICRO FOOT® Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOT® Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-11	Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-3	Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2)
Tape Information	CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE
Tape Information	MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
Tape Information	MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT
Tape Information	MICRO FOOT® 2 x 3: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8407DB-T2, Si8902EDB-T2)
Tape Information	MICROFOOT 0.8 x 0.8 CARRIER TAPE

SPICE [top]
H-Spice Model	P-Spice Model (*.lib)	P-Spice Model (*.olb)	P-Spice Model (*.txt)	Spice Model (pdf)
Si8402DB-H Si8407DB-H Si8409DB-H Si8413DB-H Si8415DB-H Si8416DB-H Si8424DB-H Si8429DB-H Si8461DB-H Si8467DB-H Si8469DB-H Si8472DB-H Si8473EDB-H Si8483DB-H Si8487DB-H Si8497DB-H Si8499DB-H Si8802DB-H	Si8402DB-P LIB Si8407DB-P LIB Si8409DB-P LIB Si8413DB-P LIB Si8415DB-P LIB Si8416DB-P LIB Si8424DB-P LIB Si8429DB-P LIB Si8461DB-P LIB Si8467DB-P LIB Si8469DB-P LIB Si8472DB-P LIB Si8473EDB-P LIB Si8483DB-P LIB Si8487DB-P LIB Si8497DB-P LIB Si8499DB-P LIB Si8802DB-P LIB	Si8402DB-P OLB Si8407DB-P OLB Si8409DB-P OLB Si8413DB-P OLB Si8415DB-P OLB Si8416DB-P OLB Si8424DB-P OLB Si8429DB-P OLB Si8461DB-P OLB Si8467DB-P OLB Si8469DB-P OLB Si8472DB-P OLB Si8473EDB-P OLB Si8483DB-P OLB Si8487DB-P OLB Si8497DB-P OLB Si8499DB-P OLB Si8802DB-P OLB	Si8402DB-P Si8407DB-P Si8409DB-P Si8413DB-P Si8415DB-P Si8416DB-P Si8424DB-P Si8429DB-P Si8461DB-P Si8467DB-P Si8469DB-P Si8472DB-P Si8473EDB-P Si8483DB-P Si8487DB-P Si8497DB-P Si8499DB-P Si8802DB-P	Si8402DB-DS Si8407DB-DS Si8409DB-DS Si8413DB-DS Si8415DB-DS Si8424DB-DS Si8429DB-DS Si8461DB-DS Si8467DB-DS Si8469DB-DS Si8472DB-DS Si8473EDB-DS Si8483DB-DS Si8487DB-DS Si8497DB-DS Si8499DB-DS Si8802DB-DS SPICE Device Model Si8416DB-DS