Related Documents - PowerPAK ChipFET
General Information (1)
Markings (1)
Package Drawings (1)
Pad Guidelines (1)
RC Thermal Models (9)
Reel Info (1)
Reliability Data (5)
Tape Info (2)
SPICE (40)
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
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Package Drawings
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Package Information |
PowerPAK® ChipFET® SINGLE PAD |
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Pad Guidelines
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Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single |
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RC Thermal Models
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Si5410DU-RC |
RC Thermal Model for Si5410DU |
Si5410DU_RC |
R-C Thermal Model Parameters |
Si5418DU-RC |
RC Thermal Model for Si5418DU |
Si5418DU_RC |
R-C Thermal Model Parameters |
Si5419DU-RC |
RC Thermal Model for Si5419DU |
Si5419DU_RC |
R-C Thermal Model Parameters |
Si5429DU_RC |
R-C Thermal Model Parameters |
Si5456DU-RC |
RC Thermal Model for Si5456DU |
Si5456DU_RC |
R-C Thermal Model Parameters |
Si5458DU-RC |
RC Thermal Model for Si5458DU |
Si5458DU_RC |
R-C Thermal Model Parameters |
Si5459DU-RC |
RC Thermal Model for Si5459DU |
Si5459DU_RC |
R-C Thermal Model Parameters |
Si5476DU-RC |
RC Thermal Model for Si5476DU |
Si5486DU-RC |
RC Thermal Model for Si5486DU |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
Tape Information |
PowerPAK® ChipFET® |
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General Information
Si5410DU-H

