Related Documents - TrenchFET® Gen III TurboFET™
General Information (1)
Markings (1)
Package Drawings (2)
Pad Guidelines (4)
RC Thermal Models (8)
Reel Info (1)
Reliability Data (3)
Tape Info (3)
SPICE (40)
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General Information
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General Information |
Useful Links |
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Markings
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Part Marking Information |
devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
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Package Drawings
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Package Information |
PowerPAK® 1212, (Single/Dual) |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
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Pad Guidelines
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AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single |
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RC Thermal Models
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SiR330DP_RC |
R-C Thermal Model Parameters |
SiR428DP-RC |
RC Thermal Model for SiR428DP |
SiR428DP_RC |
R-C Thermal Model Parameters |
SiR496DP-RC |
RC Thermal Model for SiR496DP |
SiR496DP_RC |
R-C Thermal Model Parameters |
SiS330DN_RC |
R-C Thermal Model Parameters |
SiS332DN_RC |
R-C Thermal Model Parameters |
SiS334DN_RC |
R-C Thermal Model Parameters |
SiS376DN_RC |
R-C Thermal Model Parameters |
SiS426DN-RC |
RC Thermal Model for SiS426DN |
SiS426DN_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data For PowerPAK 1212 Solder Process |
Package Reliability |
Environmental and Package Testing Data For PowerPAK SO-8 Solder Process |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
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Tape Info
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PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
Tape Information |
PowerPAK® 1212 |
Tape Information |
PowerPAK® SOIC-8 |
Useful Links
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General Information
SiR316DP-H

