Related Documents - Drain-to-source voltage 5 V to 20 V
Application Notes (1)
General Information (1)
Markings (9)
Package Drawings (17)
Pad Guidelines (26)
RC Thermal Models (79)
Reel Info (1)
Reliability Data (21)
Tape Info (31)
Technical Notes (24)
SPICE (355)
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Application Notes
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AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
PART MARKING |
MICRO FOOT Devices |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SO-8 |
PART MARKING |
SOT-23 |
PART MARKING |
TSOP-5/6 |
PART MARKING |
TSSOP-8 |
Part Marking Information |
devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
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Package Drawings
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5479 |
TO-236 (SOT-23) |
5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5547 |
ChipFET (1206-8) |
5549 |
SC-70 3L |
5550 |
SC-70 6L |
5844 |
TSSOP 8L |
5869 |
SC-89 3L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
Package Information |
Case Outline FOR PowerPAK® SC70T |
Package Information |
Case Outline for Thin PPAK SC75 Single |
Package Information |
PowerPAK® 1212, (Single/Dual) |
Package Information |
PowerPAK® ChipFET® SINGLE PAD |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
Package Information |
SC-75A: 3-LEADS |
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Pad Guidelines
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AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN811 |
Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN813 |
Single-Channel LITTLE FOOT SC-70 3-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-75A: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 3-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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Si1013CX_GE-3_RC |
R-C Thermal Model Parameters |
Si1031R-RC |
RC Thermal Model for Si1031R |
Si1067X-RC |
RC Thermal Model for Si1067X |
Si1067X_RC |
R-C Thermal Model Parameters |
Si1069X-RC |
RC Thermal Model for Si1069X |
Si1069X_RC |
R-C Thermal Model Parameters |
Si1303DL-RC |
RC Thermal Model for Si1303DL |
Si1307EDL-RC |
RC Thermal Model for Si1307EDL |
Si1315DL-GE3_RC |
R-C Thermal Model Parameters |
Si1317DL_RC |
R-C Thermal Model Parameters |
Si1401EDH_RC |
R-C Thermal Model Parameters |
Si1403CDL_RC |
R-C Thermal Model Parameters |
Si1405BDH-RC |
RC Thermal Model for Si1405BDH |
Si1405BDH_RC |
R-C Thermal Model Parameters |
Si1413EDH-RC |
RC Thermal Model for Si1413EDH |
Si1417EDH-RC |
RC Thermal Model for Si1417EDH |
Si1427EDH_RC |
R-C Thermal Model Parameters |
Si1441EDH_RC |
R-C Thermal Model Parameters |
Si1467DH-RC |
RC Thermal Model for Si1467DH |
Si1467DH_RC |
R-C Thermal Model Parameters |
Si1469DH-RC |
RC Thermal Model for Si1469DH |
Si1489EDH_RC |
R-C Thermal Model Parameters |
Si2301CDS-RC |
RC Thermal Model for Si2301CDS |
Si2301CDS_RC |
R-C Thermal Model Parameters |
Si2305CDS-RC |
RC Thermal Model for Si2305CDS |
Si2305CDS_RC |
R-C Thermal Model Parameters |
Si2323CDS_RC |
R-C Thermal Model Parameters |
Si2329DS-GE3_RC |
R-C Thermal Model Parameters |
Si2333CDS-RC |
RC Thermal Model for Si2333CDS |
Si2333CDS_RC |
R-C Thermal Model Parameters |
Si2367DS-RC |
RC Thermal Model for Si2367DS |
Si2367DS_RC |
R-C Thermal Model Parameters |
Si2377EDS_RC |
R-C Thermal Model Parameters |
Si2399DS_RC |
R-C Thermal Model Parameters |
Si3407DV-RC |
RC Thermal Model for Si3407DV |
Si3407DV_RC |
R-C Thermal Model Parameters |
Si3433CDV-RC |
RC Thermal Model for Si3433CDV |
Si3433CDV_RC |
R-C Thermal Model Parameters |
Si3443CDV-RC |
RC Thermal Model for Si3443CDV |
Si3443CDV_RC |
R-C Thermal Model Parameters |
Si3447CDV-RC |
RC Thermal Model for Si3447CDV |
Si3477DV_RC |
R-C Thermal Model Parameters |
Si3493BDV-RC |
RC Thermal Model for Si3493BDV |
Si3499DV-RC |
RC Thermal Model for Si3499DV |
Si4403CDY_RC |
R-C Thermal Model Parameters |
Si4463CDY_RC |
R-C Thermal Model Parameters |
Si4465ADY-RC |
RC Thermal Model for Si4465ADY |
Si4477DY_RC |
R-C Thermal Model Parameters |
Si5433BDC-RC |
RC Thermal Model for Si5433BDC |
Si5457DC_RC |
R-C Thermal Model Parameters |
Si5459DU-RC |
RC Thermal Model for Si5459DU |
Si5459DU_RC |
R-C Thermal Model Parameters |
Si5471DC-RC |
RC Thermal Model for Si5471DC |
Si5471DC_RC |
R-C Thermal Model Parameters |
Si5475DDC-RC |
RC Thermal Model for Si5475DDC |
Si5475DDC_RC |
R-C Thermal Model Parameters |
Si6423DQ-RC |
RC Thermal Model for Si6423DQ |
Si6433BDQ-RC |
RC Thermal Model for Si6433BDQ |
Si6463BDQ-RC |
RC Thermal Model for Si6463BDQ |
Si6467BDQ-RC |
RC Thermal Model for Si6467BDQ |
Si7137DP-RC |
RC Thermal Model for Si7137DP |
Si7137DP_RC |
R-C Thermal Model Parameters |
Si7141DP_RC |
R-C Thermal Model Parameters |
Si7403BDN-RC |
RC Thermal Model for Si7403BDN |
Si7403BDN_RC |
R-C Thermal Model Parameters |
Si7613DN-RC |
RC Thermal Model for Si7613DN |
Si7613DN_RC |
R-C Thermal Model Parameters |
Si7615DN_RC |
R-C Thermal Model Parameters |
Si7629DN_RC |
R-C Thermal Model Parameters |
Si7633DP-RC |
RC Thermal Model for Si7633DP |
Si7633DP_RC |
R-C Thermal Model Parameters |
Si7635DP-RC |
RC Thermal Model for Si7635DP |
Si7635DP_RC |
R-C Thermal Model Parameters |
Si8407DB-RC |
RC Thermal Model for Si8407DB |
Si8413DB-RC |
RC Thermal Model for Si8413DB |
Si8415DB-RC |
RC Thermal Model for Si8415DB |
Si8429DB-RC |
RC Thermal Model for Si8429DB |
Si8461DB-RC |
RC Thermal Model for Si8461DB |
Si8461DB_RC |
R-C Thermal Model Parameters |
Si8467DB_RC |
R-C Thermal Model Parameters |
Si8469DB_RC |
R-C Thermal Model Parameters |
Si8473EDB_RC |
R-C Thermal Model Parameters |
Si8499DB_RC |
R-C Thermal Model Parameters |
Si8809EDB_RC |
R-C Thermal Model Parameters |
Si9433BDY-RC |
RC Thermal Model for Si9433BDY |
SiA413DJ-RC |
RC Thermal Model for SiA413DJ |
SiA415DJ-RC |
RC Thermal Model for SiA415DJ |
SiA419DJ-RC |
RC Thermal Model for SiA419DJ |
SiA425EDJ_RC |
R-C Thermal Model Parameters |
SiA427DJ_RC |
R-C Thermal Model Parameters |
SiA429DJ_RC |
R-C Thermal Model Parameters |
SiA431DJ_RC |
R-C Thermal Model Parameters |
SiA433EDJ_RC |
R-C Thermal Model Parameters |
SiB433EDK_RC |
R-C Thermal Model Parameters |
SiB437EDKT_RC |
R-C Thermal Model Parameters |
SiB455EDK_RC |
R-C Thermal Model Parameters |
SiB457EDK-RC |
RC Thermal Model for SiB457EDK |
SiS407DN_RC |
R-C Thermal Model Parameters |
SiS902DN-RC |
RC Thermal Model for SiS902DN |
SiS902DN_RC |
R-C Thermal Model Parameters |
TP0101K-RC |
RC Thermal Model for TP0101K |
TP0101K_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for ChipFET® (1206-8) |
Package Reliability |
Environmental and Package Testing Data for MICRO FOOT® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® 1212-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-75 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SC-70 |
Package Reliability |
Environmental and Package Testing Data for SC-75A |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SOT-23 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
93-5217-1 |
Tape Drawing for SC-75A 3L |
93-5217-1 |
Tape Drawing for SC-89 3L |
Device Orientation |
Device Orientation for PowerPAK SC-70 |
Device Orientation-MICRO FOOT® Packages |
Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height |
Device Orientation-MICRO FOOT® Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-21 |
Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-11 |
Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2) |
PACK-0023-3 |
Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2) |
Tape Information |
1206-8 ChipFET® |
Tape Information |
CARRIER TAPE FOR MicroFOOT 1 x 1 mm DIE SIZE |
Tape Information |
MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
MICRO FOOT® 2 x 3: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8407DB-T2, Si8902EDB-T2) |
Tape Information |
MICROFOOT 0.8 x 0.8 CARRIER TAPE |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAK® 1212 |
Tape Information |
PowerPAK® ChipFET® |
Tape Information |
PowerPAK® SC-75 AND THIN PowerPAK SC-75 |
Tape Information |
PowerPAK® SOIC-8 |
Tape Information |
SC-70 3-LEADS (T1-METHOD) |
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Technical Notes
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Specification Comparison |
Si1403CDL vs. Si1403BDL |
Specification Comparison |
Si1405BDH vs. Si1405DL |
Specification Comparison |
Si2301CDS vs. Si2301BDS |
Specification Comparison |
Si2305CDS vs. Si2305ADS |
Specification Comparison |
Si2323CDS vs. Si2323DS |
Specification Comparison |
Si2333CDS vs. Si2315BDS |
Specification Comparison |
Si2333CDS vs. Si2333DS |
Specification Comparison |
Si3433CDV vs. Si3433BDV |
Specification Comparison |
Si3443CDV vs. Si3443BDV |
Specification Comparison |
Si3447CDV vs. Si3447BDV |
Specification Comparison |
Si3473CDV vs. Si3473DV |
Specification Comparison |
Si3493BDV vs. Si3493DV |
Specification Comparison |
Si4403CDY vs. Si4403BDY |
Specification Comparison |
Si4463CDY vs. Si4463BDY |
Specification Comparison |
Si4465ADY vs. Si4465DY |
Specification Comparison |
Si5475DDC vs. Si5475BDC |
Specification Comparison |
Si7405BDN vs. Si7405DN |
Specification Comparison: |
Si5433BDC vs. Si5433DC |
Specification Comparison: |
Si6433BDQ vs. Si6433DQ |
Specification Comparison: |
Si6463BDQ vs. Si6463ADQ |
Specification Comparison: |
Si6467BDQ vs. Si6467DQ |
Specification Comparison: |
Si7403BDN vs. Si7403DN |
Specification Comparison: |
Si9433BDY vs. Si9433DY |
Specification Comparison: |
TP0101K vs. TP0101T |
Useful Links
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AN818
Si1031R-H

