Related Documents - SkyFET
Application Notes (4)
General Information (1)
Markings (3)
Package Drawings (5)
Pad Guidelines (8)
Promotional Materials (1)
RC Thermal Models (17)
Reel Info (1)
Reliability Data (8)
Tape Info (9)
SPICE (80)
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Application Notes
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AN610 |
PolarPAK Solder Joint Reliability Based On Thermal Fatigue |
AN611 |
Development of a Lead (Pb)-Free Soldering Process for PolarPAK |
AN828 |
Working with PolarPAK In-Lab Soldering and Re-Working Recommendations |
AN829 |
PolarPAK Thermal Impedence (Rth) vs. Heat Sink Assembly Clamping Torque |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
PolarPAK |
PART MARKING |
SO-8 |
Part Marking Information |
devices: PowerPAKŪ SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
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Package Drawings
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5498 |
SOIC-8 (Narrow) |
Package Information |
PolarPAKŪ Option L |
Package Information |
PowerPAIR 6 x 3.7 |
Package Information |
PowerPAKŪ 1212, (Single/Dual) |
Package Information |
PowerPAKŪ SO-8, (Single/Dual) |
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Pad Guidelines
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AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PolarPAKŪ Option L and S |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAKŪ 1212-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAKŪ SO-8 Single |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
PowerPAIR 6 x 3.7 |
PAD Pattern |
SO-8 |
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Promotional Materials
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Product Sheet |
SkyFET Monolithic Power MOSFET and Schottky Diode |
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RC Thermal Models
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Si4622DY-RC |
RC Thermal Model for Si4622DY |
Si4622DY_RC |
R-C Thermal Model Parameters |
Si4628DY-RC |
RC Thermal Model for Si4628DY |
Si4628DY_RC |
R-C Thermal Model Parameters |
Si4712DY_RC |
R-C Thermal Model Parameters |
Si4752DY_RC |
R-C Thermal Model Parameters |
Si4774DY_RC |
R-C Thermal Model Parameters |
Si4776DY_RC |
R-C Thermal Model Parameters |
Si7748DP-RC |
RC Thermal Model for Si7748DP |
Si7748DP_RC |
R-C Thermal Model Parameters |
Si7772DP_RC |
R-C Thermal Model Parameters |
Si7774DP_RC |
R-C Thermal Model Parameters |
Si7792DP_RC |
R-C Thermal Model Parameters |
Si7794DP_RC |
R-C Thermal Model Parameters |
SiE726DF-RC |
RC Thermal Model for SiE726DF |
SiE726DF_RC |
R-C Thermal Model Parameters |
SiR774DP_RC |
R-C Thermal Model Parameters |
SiS778DN_RC |
R-C Thermal Model Parameters |
SiS780DN_RC |
R-C Thermal Model Parameters |
SiS782DN_RC |
R-C Thermal Model Parameters |
SiZ790DT_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data For PolarPAK |
Package Reliability |
Environmental and Package Testing Data for PowerPAIRŪ 6 x 3.7 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ 1212-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
SkyFETŪ (N-Channel MOSFET and Schottky Diode) Accelerated Operating Life Test Result |
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Tape Info
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91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
Device Orientation |
Device Orientation for PowerPAIR |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-21 |
Device Orientation for PolarPAK (T1) |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
Tape Information |
PolarPAKŪ Carrier Tape |
Tape Information |
PowerPAIR 6 x 3.7 CARRIER TAPE |
Tape Information |
PowerPAKŪ 1212 |
Tape Information |
PowerPAKŪ SOIC-8 |
Useful Links
- Service and Support
- Product Information
- Featured Products



AN610
Si4622DY-H

