Markings (3)
  Pad Guidlines (12)
  Package Drawing (5)
  Reliability Data (11)
  Reel Info (1)
  Technical Note (1)
  RC Thermal Models (13)
  Tape Info (7)
  SPICE (30)

Markings
PART MARKING	PowerPAK SO-8, PowerPAK 1212-8
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET
PART MARKING	TSOP-5/6

Pad Guidlines
AN822	PowerPAK 1212 Mounting and Thermal Considerations
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK 1212-8 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Single	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Single
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Package Drawing
5540	TSOP (5L & 6L)
5547	ChipFET (1206-8)
5940	PowerPAK ChipFET Single Pad
5940	PowerPAK ChipFET Dual Pad
Package Information	PowerPAK? 1212, (Single/Dual)

Reliability Data
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Schottky Diode Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

Technical Note
Specification Comparison	Si5853CDC vs. Si5853DC

RC Thermal Models
Si3812DV-RC	RC Thermal Model for Si3812DV
Si3851DV-RC	RC Thermal Model for Si3851DV
Si3853DV-RC	RC Thermal Model for Si3853DV
Si3879DV-RC	RC Thermal Model for Si3879DV
Si5853CDC-RC	RC Thermal Model for Si5853CDC
Si5855CDC-RC	RC Thermal Model for Si5855CDC
Si5855CDC_RC	R-C Thermal Model Parameters
Si5856DC-RC	RC Thermal Model for Si5856DC
Si5857DU-RC	RC Thermal Model for Si5857DU
Si5858DU-RC	RC Thermal Model for Si5858DU
Si5913DC-RC	RC Thermal Model for Si5913DC
Si5913DC_RC	R-C Thermal Model Parameters
Si7703EDN-RC	RC Thermal Model for Si7703EDN

Tape Info
93-2345-x	Tape Drawing for TSOP-6
93-2346-x	Tape Drawing for ChipFET (1206-8)
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
Tape Information	PowerPAK? 1212

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si3853DV-H  Si3879DV-H  Si5856DC-H  Si5857DU-H  Si5858DU-H  Si7703EDN-H	Si3853DV-P  Si3879DV-P  Si5856DC-P  Si5857DU-P  Si5858DU-P  Si7703EDN-P	Si3853DV-P OLB  Si3879DV-P OLB  Si5856DC-P OLB  Si5857DU-P OLB  Si5858DU-P OLB  Si7703EDN-P OLB	Si3853DV-P LIB  Si3879DV-P LIB  Si5856DC-P LIB  Si5857DU-P LIB  Si5858DU-P LIB  Si7703EDN-P LIB	Si3853DV-DS  Si3879DV-DS  Si5856DC-DS  Si5857DU-DS  Si5858DU-DS  Si7703EDN-DS