Markings (1)
  Pad Guidlines (4)
  Package Drawing (2)
  Reliability Data (3)
  Reel Info (1)
  RC Thermal Models (4)
  Tape Info (2)
  SPICE (15)

Markings
PART MARKING	1206-8 ChipFET and PowerPAK ChipFET

Pad Guidlines
AN826 - PowerPAK ChipFET Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Single	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Single
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual

Package Drawing
5940	PowerPAK ChipFET Single Pad
5940	PowerPAK ChipFET Dual Pad

Reliability Data
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	N-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si5410DU-RC	RC Thermal Model for Si5410DU
Si5410DU_RC	R-C Thermal Model Parameters
Si5476DU-RC	RC Thermal Model for Si5476DU
Si5944DU-RC	RC Thermal Model for Si5944DU

Tape Info
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si5410DU-H  Si5476DU-H  Si5944DU-H	Si5410DU-P  Si5476DU-P  Si5944DU-P	Si5410DU-P OLB  Si5476DU-P OLB  Si5944DU-P OLB	Si5410DU-P LIB  Si5476DU-P LIB  Si5944DU-P LIB	Si5410DU-DS  Si5476DU-DS  Si5944DU-DS