Related Documents - Drain-to-source voltage 21 V to 30 V
Application Notes (2)
General Information (1)
Markings (11)
Package Drawings (14)
Pad Guidelines (29)
RC Thermal Models (57)
Reel Info (1)
Reliability Data (27)
Tape Info (26)
Technical Notes (21)
SPICE (262)
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Application Notes
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AN818 |
Single-Channel TSOP-6, Alternate Package for Products Utilizine the 1206-8 Single-Channel ChipFET |
AN827 |
Torque Recommendations for TO-220 Devices |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
1206-8 ChipFET and PowerPAK ChipFET |
PART MARKING |
MICRO FOOT Devices |
PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SC-75A and SC-89 Devices |
PART MARKING |
SO-8 |
PART MARKING |
SOT-23 |
PART MARKING |
TO-252 (DPAK), TO-251 |
PART MARKING |
TSOP-5/6 |
PART MARKING |
TSSOP-8 |
Part Marking Information |
devices: PowerPAK® SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
Part Marking Information |
devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5) |
Part Marking Information |
TO-252 (DPAK), TO251 |
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Package Drawings
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5479 |
TO-236 (SOT-23) |
5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5547 |
ChipFET (1206-8) |
5550 |
SC-70 6L |
5844 |
TSSOP 8L |
5880 |
SC-89 (SOT-563F) 6L |
5934 |
PowerPAK SC70-6L |
5935 |
PowerPAK SC75-6L |
Package Information |
PowerPAK® 1212, (Single/Dual) |
Package Information |
PowerPAK® ChipFET® SINGLE PAD |
Package Information |
PowerPAK® SO-8, (Single/Dual) |
Package Information |
TO-220AB |
Package Information |
TO-252AA |
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Pad Guidelines
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AN1001 |
LITTLE FOOT TSSOP-8, The Next Step in Surface-Mount Power MO |
AN806 |
Mounting LITTLE FOOT TSSOP-8 Power MOSFETs |
AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN811 |
Single-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN812 |
Dual-Channel 1206-8 ChipFET Power MOSFET Recommended Pad Pattern/Thermal Performance |
AN814 |
Dual-Channel LITTLE FOOT SC-70 6-Pin and 6-Pin MOSFET Recommended Pad Pattern/Thermal Performance |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET® |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual |
Application Note 826 |
RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Dual |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-89: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR TSSOP-8 |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc70-6L Dual |
Application Note 826 |
RECOMMENDED PAD LAYOUT FOR PowerPAK® SC70-6L Single |
Application Note 826 |
RECOMMENDED pad LAYOUT FOR PowerPAK® Sc75-6L Single |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
MICRO FOOT Products |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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Si1071X-RC |
RC Thermal Model for Si1071X |
Si1071X_RC |
R-C Thermal Model Parameters |
Si1073X-RC |
RC Thermal Model for Si1073X |
Si1443EDH-GE3_RC |
R-C Thermal Model Parameters |
Si1473DH-RC |
RC Thermal Model for Si1473DH |
Si1539CDL_RC |
R-C Thermal Model Parameters |
Si2307CDS-RC |
RC Thermal Model for Si2307CDS |
Si2307CDS_RC |
R-C Thermal Model Parameters |
Si2343CDS_RC |
R-C Thermal Model Parameters |
Si3457CDV-RC |
RC Thermal Model for Si3457CDV |
Si3457CDV_RC |
R-C Thermal Model Parameters |
Si3483CDV-RC |
RC Thermal Model for Si3483CDV |
Si3483CDV_RC |
R-C Thermal Model Parameters |
Si3552DV-RC |
RC Thermal Model for Si3552DV |
Si3590DV-RC |
RC Thermal Model for Si3590DV |
Si3993CDV_RC |
R-C Thermal Model Parameters |
Si4425DDY-RC |
RC Thermal Model for Si4425DDY |
Si4425DDY_RC |
R-C Thermal Model Parameters |
Si4431CDY-RC |
RC Thermal Model for Si4431CDY |
Si4431CDY_RC |
R-C Thermal Model Parameters |
Si4435DDY-RC |
RC Thermal Model for Si4435DDY |
Si4435DDY_RC |
R-C Thermal Model Parameters |
Si4459ADY-RC |
RC Thermal Model for Si4459ADY |
Si4459ADY_RC |
R-C Thermal Model Parameters |
Si4483ADY-RC |
RC Thermal Model for Si4483ADY |
Si4483ADY_RC |
R-C Thermal Model Parameters |
Si4485DY-RC |
RC Thermal Model for Si4485DY |
Si4485DY_RC |
R-C Thermal Model Parameters |
Si4487DY_RC |
R-C Thermal Model Parameters |
Si4497DY_RC |
R-C Thermal Model Parameters |
Si4532CDY |
R-C Thermal Model Parameters |
Si4825DDY-RC |
RC Thermal Model for Si4825DDY |
Si4825DDY_RC |
R-C Thermal Model Parameters |
Si4925DDY-RC |
RC Thermal Model for Si4925DDY |
Si4925DDY_RC |
R-C Thermal Model Parameters |
Si4953ADY-RC |
RC Thermal Model for Si4953ADY |
Si5403DC-RC |
RC Thermal Model for Si5403DC |
Si5403DC_RC |
R-C Thermal Model Parameters |
Si5419DU-RC |
RC Thermal Model for Si5419DU |
Si5419DU_RC |
R-C Thermal Model Parameters |
Si5429DU_RC |
R-C Thermal Model Parameters |
Si5435BDC-RC |
RC Thermal Model for Si5435BDC |
Si5504BDC-RC |
RC Thermal Model for Si5504BDC |
Si5997DU_RC |
R-C Thermal Model Parameters |
Si6415DQ-RC |
RC Thermal Model for Si6415DQ |
Si6435ADQ-RC |
RC Thermal Model for Si6435ADQ |
Si6544BDQ-RC |
RC Thermal Model for Si6544BDQ |
Si6993DQ-RC |
RC Thermal Model for Si6993DQ |
Si7121DN-RC |
RC Thermal Model for Si7121DN |
Si7121DN_RC |
R-C Thermal Model Parameters |
Si7129DN-RC |
RC Thermal Model for Si7129DN |
Si7129DN_RC |
R-C Thermal Model Parameters |
Si7135DP-RC |
RC Thermal Model for Si7135DP |
Si7135DP_RC |
R-C Thermal Model Parameters |
Si7139DP_RC |
R-C Thermal Model Parameters |
Si7143DP_RC |
R-C Thermal Model Parameters |
Si7145DP-RC |
RC Thermal Model for Si7145DP |
Si7145DP_RC |
R-C Thermal Model Parameters |
Si7149DP-RC |
RC Thermal Model for Si7149DP |
Si7459BDP_RC |
R-C Thermal Model Parameters |
Si7617DN_RC |
R-C Thermal Model Parameters |
Si7619DN_RC |
R-C Thermal Model Parameters |
Si7625DN-DS |
SPICE datasheet |
Si7625DN_RC |
R-C Thermal Model Parameters |
Si7923DN-RC |
RC Thermal Model for Si7923DN |
Si7997DP_RC |
R-C Thermal Model Parameters |
Si8409DB-RC |
RC Thermal Model for Si8409DB |
Si8497DB_RC |
R-C Thermal Model Parameters |
SiA421DJ-RC |
RC Thermal Model for SiA421DJ |
SiA915DJ_RC |
R-C Thermal Model Parameters |
SiA929DJ_RC |
R-C Thermal Model Parameters |
SiB415DK-RC |
RC Thermal Model for SiB415DK |
SiB415DK_RC |
R-C Thermal Model Parameters |
SUB75P03-07-RC |
RC Thermal Model for SUB75P03-07 |
SUD45P03-09_RC |
R-C Thermal Model Parameters |
SUP75P03-07-RC |
RC Thermal Model for SUP75P03-07 |
SUP75P03-07_RC |
R-C Thermal Model Parameters |
TP0202K-RC |
RC Thermal Model for TP0202K |
TP0202K_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
Lok Reel |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for ChipFET® (1206-8) |
Package Reliability |
Environmental and Package Testing Data for DPAK, TO-252, TO-251 |
Package Reliability |
Environmental and Package Testing Data for MICRO FOOT® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® 1212-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® ChipFET® |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-70 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SC-75 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAK® SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SC-70 |
Package Reliability |
Environmental and Package Testing Data for SC-89 |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 Solder Process |
Package Reliability |
Environmental and Package Testing Data for SOT-23 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data For TO-220 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
N-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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90-2339-1 |
Tape Drawing for TO-252 (DPAK) (T1 Method) |
90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
90-2369-x |
Tape Drawing for TO-252 (DPAK) (T4 Method) |
90-2377-1 |
Tape Drawing for SC-89 6L (TO-563) Flat |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
Device Orientation-MICRO FOOT® Packages |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height |
PACK-0007-13 |
Device Orientation for 1206-8 ChipFET (T1) |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-21 |
Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0020- |
Device Orientation for TO-252 and Reverse TO-252 (T4) |
PACK-0020- |
Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1) |
PACK-0023-1 |
Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1) |
PACK-0023-10 |
Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2) |
Tape Information |
1206-8 ChipFET® |
Tape Information |
MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1) |
Tape Information |
MICRO FOOT® 2 x 3: 0.5 mm PITCH, 0.25 mm BUMP HEIGHT |
Tape Information |
PowerPAK SC70 |
Tape Information |
PowerPAK® 1212 |
Tape Information |
PowerPAK® ChipFET® |
Tape Information |
PowerPAK® SC-75 AND THIN PowerPAK SC-75 |
Tape Information |
PowerPAK® SOIC-8 |
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Technical Notes
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Specification Comparison |
Si1539CDL vs. Si1539DL |
Specification Comparison |
Si2303CDS vs. Si2303BDS |
Specification Comparison |
Si2307CDS vs. Si2307BDS |
Specification Comparison |
Si2307CDS vs. Si2307DS |
Specification Comparison |
Si3457CDV vs. Si3457BDV |
Specification Comparison |
Si3483CDV vs. Si3483DV |
Specification Comparison |
Si3993CDV vs. Si3993DV |
Specification Comparison |
Si4425DDY vs. Si4425BDY |
Specification Comparison |
Si4431CDY vs. Si4431BDY |
Specification Comparison |
Si4435DDY vs. Si4435BDY |
Specification Comparison |
Si4532CDY vs. Si4532ADY |
Specification Comparison |
Si4825DDY vs. Si4825DY |
Specification Comparison |
Si4833BDY vs. Si4833ADY |
Specification Comparison |
Si4835DDY vs. Si4835BDY |
Specification Comparison |
Si4925DDY vs. Si4925BDY |
Specification Comparison |
Si4953ADY vs. Si4953DY |
Specification Comparison |
Si5504BDC vs. Si5504DC |
Specification Comparison |
SUP75P03-07 vs. SUP75P03-08 |
Specification Comparison: |
Si5435BDC vs. Si5435DC |
Specification Comparison: |
Si6544BDQ vs. Si6544DQ |
Specification Comparison: |
TP0202K vs. TP0202T |
Useful Links
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AN818
Si1071X-H

