Related Documents - Drain-to-source voltage 81 and up
Application Notes (1)
General Information (1)
Markings (7)
Package Drawings (16)
Pad Guidelines (14)
RC Thermal Models (41)
Reel Info (3)
Reliability Data (10)
Tape Info (25)
SPICE (128)
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Application Notes
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AN827 |
Torque Recommendations for TO-220 Devices |
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General Information
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General Information |
Useful Links |
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Markings
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PART MARKING |
SC-70 for Si Part Numbers |
PART MARKING |
SO-8 |
PART MARKING |
SOT-23 |
PART MARKING |
TO-252 (DPAK), TO-251 |
PART MARKING |
TSOP-5/6 |
Part Marking Information |
devices: PowerPAKŪ SO-8, PowerPAK SO-8L, PowerPAK 1212-8, PowerPAIR™ 6 x 3.7 |
Part Marking Information |
devices: TO-220, TO-262, TO-263 (D2PAK, D2PAK-5) |
Part Marking Information |
TO-252 (DPAK), TO251 |
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Package Drawings
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5346 |
TO-251 (IPAK) |
5479 |
TO-236 (SOT-23) |
5498 |
SOIC-8 (Narrow) |
5540 |
TSOP (5L & 6L) |
5550 |
SC-70 6L |
Package Information |
HVMDIP (High Voltage) |
Package Information |
PowerPAKŪ 1212, (Single/Dual) |
Package Information |
PowerPAKŪ SO-8, (Single/Dual) |
Package Information |
SOT-223 (High Voltage) |
Package Information |
TO-220AB |
Package Information |
TO-247AC (High Voltage) |
Package Information |
TO-251AA (High Voltage) |
Package Information |
TO-252AA |
Package Information |
TO-252AA (High Voltage) |
Package Information |
TO-263 (D2PAK): 3-LEAD |
Package Information |
TO-263AB (High Voltage) |
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Pad Guidelines
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AN807 |
Mounting LITTLE FOOT SOT-23 Power MOSFETs |
AN815 |
Single-Channel LITTLE FOOT SC-70 6-Pin MOSFET-Copper Leadframe Recommended Pad Pattern/Thermal Performance |
AN821 |
PowerPAK SO-8 Mounting and Thermal Considerations |
AN822 |
PowerPAK 1212 Mounting and Thermal Considerations |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAKŪ 1212-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR PowerPAKŪ SO-8 Single |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SC-70: 6-Lead |
Application Note 826 |
RECOMMENDED MINIMUM PADS FOR SoT-23 |
PAD Pattern |
D2PAK |
PAD Pattern |
LITTLE FOOT SO-8 Power MOSFETs |
PAD Pattern |
LITTLE FOOT TSOP-6 Power MOSFETs |
PAD Pattern |
SO-8 |
PAD Pattern |
TSOP-6 |
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RC Thermal Models
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IRFD9110_RC, SiHFD9110_RC |
R-C Thermal Model Parameters |
IRFD9120_RC, SiHFD9120_RC |
R-C Thermal Model Parameters |
IRFD9210_RC, SiHFD9210_RC |
R-C Thermal Model Parameters |
IRFD9220_RC, SiHFD9220_RC |
R-C Thermal Model Parameters |
IRFI9520G_RC, SiHFI9520G_RC |
R-C Thermal Model Parameters |
IRFI9530G_RC, SiHFI9530G_RC |
R-C Thermal Model Parameters |
IRFI9540G_RC, SiHFI9540G_RC |
R-C Thermal Model Parameters |
IRFI9610G_RC, SiHFI9610G_RC |
R-C Thermal Model Parameters |
IRFI9620G_RC, SiHFI9620G_RC |
R-C Thermal Model Parameters |
IRFI9630G_RC, SiHFI9630G_RC |
R-C Thermal Model Parameters |
IRFI9634G_RC, SiHFI9634G_RC |
R-C Thermal Model Parameters |
IRFI9640G_RC, SiHFI9640G_RC |
R-C Thermal Model Parameters |
IRFL9110_RC, SiHFL9110_RC |
R-C Thermal Model Parameters |
IRFP9140_RC, SiHFP9140_RC |
R-C Thermal Model Parameters |
IRFP9240_RC, SiHFP9240_RC |
R-C Thermal Model Parameters |
Si1411DH-RC |
RC Thermal Model for Si1411DH |
Si1419DH-RC |
RC Thermal Model for Si1419DH |
Si2325DS-RC |
RC Thermal Model for Si2325DS |
Si2327DS-RC |
RC Thermal Model for Si2327DS |
Si3437DV-RC |
RC Thermal Model for Si3437DV |
Si3475DV-RC |
RC Thermal Model for Si3475DV |
Si4409DY-RC |
RC Thermal Model for Si4409DY |
Si4455DY-RC |
RC Thermal Model for Si4455DY |
Si4455DY_RC |
R-C Thermal Model Parameters |
Si7113DN-RC |
RC Thermal Model for Si7113DN |
Si7115DN-RC |
RC Thermal Model for Si7115DN |
Si7117DN-RC |
RC Thermal Model for Si7117DN |
Si7119DN-RC |
RC Thermal Model for Si7119DN |
Si7431DP-RC |
RC Thermal Model for Si7431DP |
Si7439DP-RC |
RC Thermal Model for Si7439DP |
Si7489DP-RC |
RC Thermal Model for Si7489DP |
SiHFR9110_RC, SiHFU9110_RC |
R-C Thermal Model Parameters |
SiHFR9120_RC, SiHFU9120_RC |
R-C Thermal Model Parameters |
SiHFR9210_RC, SiHFU9210_RC |
R-C Thermal Model Parameters |
SiHFR9214_RC, SiHFU9214_RC |
R-C Thermal Model Parameters |
SiHFR9220_RC, SiHFU9220_RC |
R-C Thermal Model Parameters |
SiHFR9310_RC, SiHFU9310_RC |
R-C Thermal Model Parameters |
SUD09P10-195_RC |
R-C Thermal Model Parameters |
SUD50NP04-145-RC |
RC Thermal Model for SUD50NP04-145 |
SUD50P10-43L-RC |
RC Thermal Model for SUD50P10-43L |
SUM90P10-19L_RC |
R-C Thermal Model Parameters |
SUP40P10-43_RC |
R-C Thermal Model Parameters |
SUU10P10-195-GE3_RC |
R-C Thermal Model Parameters |
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Reel Info
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Reel Information |
DPAK Reel |
Reel Information |
Lok Reel |
Reel Information |
Reel for SOT223 |
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Reliability Data
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Package Reliability |
Environmental and Package Testing Data for D2PAK, TO-263 |
Package Reliability |
Environmental and Package Testing Data for DPAK, TO-252, TO-251 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ 1212-8 |
Package Reliability |
Environmental and Package Testing Data for PowerPAKŪ SO-8 |
Package Reliability |
Environmental and Package Testing Data for SO-8 |
Package Reliability |
Environmental and Package Testing Data for SSOT-23 |
Package Reliability |
Environmental and Package Testing Data For TO-220 |
Package Reliability |
Environmental and Package Testing Data for TSOP-6 |
Package Reliability |
SC-70-6 (Cu) |
Silicon Technology Reliability |
P-Channel Accelerated Operating Life Test Result |
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Tape Info
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90-2339-1 |
Tape Drawing for TO-252 (DPAK) (T1 Method) |
90-2342-x |
TO-263 (D2PAK): 3- and 5-lead |
90-2369-x |
Tape Drawing for TO-252 (DPAK) (T4 Method) |
91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
91-5209-x |
Tape Drawing for SOT-23 (T1 and T2 Methods) |
93-2345-X |
TSOP: 5/6-Lead (SC-59) |
93-5213-X |
SC-70 3-LEADS (T2-METHOD) |
Device Orientation |
TR Device Orientation for SOT-223 |
Device Orientation |
TR Device Orientation for TO-252 |
Device Orientation |
TRL Device Orientation for TO-252 |
Device Orientation |
TRL Device Orientation for TO-263 |
Device Orientation |
TRR Device Orientation for TO-252 |
Device Orientation |
TRR Device Orientation for TO-263 |
PACK-0007-14 |
Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1) |
PACK-0007-2 |
Device Orientation for SC70-3L, SC75A, SC89-3L, and SOT-23 (T1) |
PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
PACK-0020- |
Device Orientation for TO-252 and Reverse TO-252 (T4) |
PACK-0020- |
Device Orientation for TO-252, Reverse TO-252 and TO-251 Short Lead (T1) |
PACK-0020- |
Device Orientation for TO-263 (T1) |
Tape Information |
Carrier Tape for DPAK TE1 and TE2 |
Tape Information |
Carrier Tape for DPAK TE3 |
Tape Information |
PowerPAKŪ 1212 |
Tape Information |
PowerPAKŪ SOIC-8 |
Tape Information |
SOT223 TE1 TR |
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AN827
Si1411DH-H

