Markings (1)
  Pad Guidlines (1)
  Reliability Data (4)
  Reel Info (1)
  RC Thermal Models (14)
  Tape Info (10)
  SPICE (54)

Markings
PART MARKING	MICRO FOOT Devices

Pad Guidlines
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products

Reliability Data
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.5 mm Pitch)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si8401DB-RC	RC Thermal Model for Si8401DB
Si8407DB-RC	RC Thermal Model for Si8407DB
Si8413DB-RC	RC Thermal Model for Si8413DB
Si8415DB-RC	RC Thermal Model for Si8415DB
Si8417DB-RC	RC Thermal Model for Si8417DB
Si8417DB_RC	R-C Thermal Model Parameters
Si8429DB-RC	RC Thermal Model for Si8429DB
Si8435DB-RC	RC Thermal Model for Si8435DB
Si8441DB-RC	RC Thermal Model for Si8441DB
Si8445DB-RC	RC Thermal Model for Si8445DB
Si8445DB_RC	R-C Thermal Model Parameters
Si8451DB-RC	RC Thermal Model for Si8451DB
Si8451DB_RC	R-C Thermal Model Parameters
Si8901EDB-RC	RC Thermal Model for Si8901EDB

Tape Info
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5223-x	Tape Drawing for MICRO FOOT 2x3, 0.8 mm Pitch, 0.275 mm bump height
93-5257-X	Tape Drawing for MICRO FOOT 2x3, 0.5 mm Pitch, 0.25 Bump Height
93-5258-X	Tape Drawing for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-11	Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-3	Device Orientation for MOSFETs, MICRO FOOT 2x3: 0.8-mm Pitch, 0.275-mm Bump Height (T2)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si8401DB-H  Si8407DB-H  Si8413DB-H  Si8415DB-H  Si8417DB-H  Si8429DB-H  Si8435DB-H  Si8441DB-H  Si8445DB-H  Si8451DB-H  Si8901EDB-H	Si8401DB-P  Si8407DB-P  Si8413DB-P  Si8415DB-P  Si8417DB-P  Si8429DB-P  Si8435DB-P  Si8441DB-P  Si8445DB-P  Si8451DB-P  Si8901EDB-P	Si8401DB-P LIB  Si8407DB-P OLB  Si8413DB-P OLB  Si8415DB-P OLB  Si8417DB-P OLB  Si8429DB-P OLB  Si8435DB-P OLB  Si8441DB-P OLB  Si8445DB-P OLB  Si8451DB-P OLB  Si8901EDB-P OLB	Si8407DB-P LIB  Si8413DB-P LIB  Si8415DB-P LIB  Si8417DB-P LIB  Si8429DB-P LIB  Si8435DB-P LIB  Si8441DB-P LIB  Si8445DB-P LIB  Si8451DB-P LIB  Si8901EDB-P LIB	Si8401DB-DS  Si8407DB-DS  Si8413DB-DS  Si8415DB-DS  Si8417DB-DS  Si8429DB-DS  Si8435DB-DS  Si8441DB-DS  Si8445DB-DS  Si8451DB-DS  Si8901EDB-DS