Related Documents - Vishay MOSFETs, Drain-to-source voltage < -6V to -20 V, MOSFET + Schottky Combo

Related Documents

  Markings (4)
  Pad Guidlines (15)
  Package Drawing (6)
  Reliability Data (10)
  Reel Info (1)
  Technical Note (1)
  RC Thermal Models (11)
  Tape Info (11)
  SPICE (40)

Pad Guidlines
AN808	Mounting LITTLE FOOT SO-8 Power MOSFETs
AN822	PowerPAK 1212 Mounting and Thermal Considerations
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN826 - 1206-8 ChipFET	Recommended Minimum PAD Pattern
AN826 - PowerPAK 1212-8 Single	Recommended Minimum PAD Pattern
AN826 - PowerPAK ChipFET Dual	Recommended Minimum PAD Pattern
AN826 - PowerPAK SC70 Dual	Recommended Minimum PAD Pattern
AN826 - SO-8	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED minimum pads FOR PowerPAK? ChipFET? Dual
Application Note 826	RECOMMENDED pad LAYOUT FOR PowerPAK? Sc70-6L Dual
Application Note 826	RECOMMENDED MINIMUM PADS FOR 1206-8 ChipFET?
Application Note 826	RECOMMENDED MINIMUM PADS FOR PowerPAK? 1212-8 Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR So-8
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Reliability Data
Package Reliability	Environmental and Package Testing Data For 1206-8 ChipFET
Package Reliability	Environmental and Package Testing Data For SOIC 8 Lead (DY)
Package Reliability	Environmental and Package Testing Data For PowerPAK 1212
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For PowerPAK ChipFET
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability	Accelerated Operating Life Test Result
Silicon Technology Reliability	Schottky Diode Accelerated Operating Life Test Result

RC Thermal Models
Si3853DV-RC	RC Thermal Model for Si3853DV
Si3879DV-RC	RC Thermal Model for Si3879DV
Si4621DY-RC	RC Thermal Model for Si4621DY
Si4845DY-RC	RC Thermal Model for Si4845DY
Si5853CDC-RC	RC Thermal Model for Si5853CDC
Si5855DC-RC	RC Thermal Model for Si5855DC
Si5857DU-RC	RC Thermal Model for Si5857DU
Si7703EDN-RC	RC Thermal Model for Si7703EDN
SiA811DJ-RC	RC Thermal Model for SiA811DJ
SiA813DJ-RC	RC Thermal Model for SiA813DJ
SiA813DJ_RC	R-C Thermal Model Parameters

Tape Info
91-5209-x	Tape Drawing for SOIC (8L, 14L, 16L Narrow & 14L, 20L, 24L Wide)
93-2345-x	Tape Drawing for TSOP-6
93-2346-x	Tape Drawing for ChipFET (1206-8)
93-5240-x	Tape Drawing for PowerPAK SC-70
93_5248_x	Tape Drawing for PowerPAK ChipFET
PACK-0007-13	Device Orientation for 1206-8 ChipFET (T1)
PACK-0007-14	Device Orientation for PowerPAK 1212-8 and PowerPAK SO-8 (T1)
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-6	Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1)
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
Tape Information	PowerPAK? 1212

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si3853DV-H Si3879DV-H Si4621DY-H Si4845DY-H Si5855DC-H Si5857DU-H Si7703EDN-H SiA811DJ-H	Si3853DV-P Si3879DV-P Si4621DY-P Si4845DY-P Si5855DC-P Si5857DU-P Si7703EDN-P SiA811DJ-P	Si3853DV-P OLB Si3879DV-P OLB Si4621DY-P OLB Si4845DY-P OLB Si5855DC-P OLB Si5857DU-P OLB Si7703EDN-P OLB SiA811DJ-P OLB	Si3853DV-P LIB Si3879DV-P LIB Si4621DY-P LIB Si4845DY-P LIB Si5855DC-P LIB Si5857DU-P LIB Si7703EDN-P LIB SiA811DJ-P LIB	Si3853DV-DS Si3879DV-DS Si4621DY-DS Si4845DY-DS Si5855DC-DS Si5857DU-DS Si7703EDN-DS SiA811DJ-DS

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