Markings (2)
  Pad Guidlines (6)
  Package Drawing (2)
  Reliability Data (5)
  Reel Info (1)
  RC Thermal Models (9)
  Tape Info (12)
  SPICE (35)

Markings
PART MARKING	TSOP-5/6
PART MARKING	MICRO FOOT Devices

Pad Guidlines
AN823	Mounting LITTLE FOOT TSOP-6 Power MOSFETs
AN824	PCB Design and Assembly Guidelines for MICRO FOOT Products
AN826 - PowerPAK SC70 Single	Recommended Minimum PAD Pattern
AN826 - TSOP-6	Recommended Minimum PAD Pattern
Application Note 826	RECOMMENDED PAD LAYOUT FOR PowerPAK? SC70-6L Single
Application Note 826	RECOMMENDED MINIMUM PADS FOR TSOP-6

Package Drawing
5540	TSOP (5L & 6L)
5934	PowerPAK SC70-6L

Reliability Data
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.5 mm Pitch)
Package Reliability	Environmental and Package Testing Data For MICRO FOOT (0.8 mm Pitch)
Package Reliability	Environmental and Package Testing Data For TSOP-5/6
Package Reliability	Environmental and Package Testing Data For PowerPAK SC-70
Silicon Technology Reliability	P-Channel Accelerated Operating Life Test Result

Reel Info
Reel Information	LOK REEL

RC Thermal Models
Si3495DV-RC	RC Thermal Model for Si3495DV
Si8435DB-RC	RC Thermal Model for Si8435DB
Si8441DB-RC	RC Thermal Model for Si8441DB
Si8445DB-RC	RC Thermal Model for Si8445DB
Si8445DB_RC	R-C Thermal Model Parameters
Si8451DB-RC	RC Thermal Model for Si8451DB
Si8451DB_RC	R-C Thermal Model Parameters
SiA411DJ-RC	RC Thermal Model for SiA411DJ
SiA419DJ-RC	RC Thermal Model for SiA419DJ

Tape Info
93-2345-x	Tape Drawing for TSOP-6
93-5222-x	Tape Drawing for MICRO FOOT 2x2, 0.8 mm Pitch, 0.275 mm bump height
93-5240-x	Tape Drawing for PowerPAK SC-70
93-5257-X	Tape Drawing for MICRO FOOT 2x3, 0.5 mm Pitch, 0.25 Bump Height
93-5258-X	Tape Drawing for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm Bump Height
Device Orientation-MICRO FOOT? Packages	Device Orientation for MICRO FOOT 2x2, 0.5 mm Pitch, 0.25 Bump Height
PACK-0007-21	Device Orientation for PowerPAK SC-70, PowerPAK SC-75
PACK-0007-8/9	Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1)
PACK-0023-1	Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
PACK-0023-10	Device Orientation for MICRO FOOT 2x3, 0.5 mm pitch, 0.250 mm bump height (T2)
PACK-0023-11	Device Orientation for MICRO FOOT 2x2, 0.5 mm pitch, 0.250 mm bump height (T2)

SPICE
H-SPICE	P-SPICE	P-SPICE (*.olb)	P-SPICE (*.lib)	SPICE PDF
Si3495DV-H  Si8435DB-H  Si8441DB-H  Si8445DB-H  Si8451DB-H  SiA411DJ-H  SiA419DJ-H	Si3495DV-P  Si8435DB-P  Si8441DB-P  Si8445DB-P  Si8451DB-P  SiA411DJ-P  SiA419DJ-P	Si3495DV-P OLB  Si8435DB-P OLB  Si8441DB-P OLB  Si8445DB-P OLB  Si8451DB-P OLB  SiA411DJ-P OLB  SiA419DJ-P OLB	Si3495DV-P LIB  Si8435DB-P LIB  Si8441DB-P LIB  Si8445DB-P LIB  Si8451DB-P LIB  SiA411DJ-P LIB  SiA419DJ-P LIB	Si3495DV-DS  Si8435DB-DS  Si8441DB-DS  Si8445DB-DS  Si8451DB-DS  SiA411DJ-DS  SiA419DJ-DS