Related Documents - Power Distribution - Load Switch

  Markings (1)
  Package Drawings (6)
  Packaging Information (1)
  Pad Guidelines (1)
  Reel Info (1)
  Reliability Data (4)
  Tape Info (6)

Markings [top]
Part Marking Information	MICR FOOT

Package Drawings [top]
5926	Thin SOT-23: 5- and 6-Lead Package Outline (Power IC Only)
5941	SC-70: 3/4/5/6-Lead Package Outline (Power IC Only)
5953	PowerPAK SC75-6L (Power IC only)
5955	PowerPAK TSC75-6 (Power IC Only)
5997	TDFN8 2x2
Package Information	TDFN4 1.2 x 1.6 Case Outline

Packaging Information [top]
Package Information	WCSP4: 4 Bumps

Pad Guidelines [top]
PAD Pattern	TFDN4 1.2 x 1.6

Reel Info [top]
Reel Information	Lok Reel

Reliability Data [top]
Package Reliability	Environmental and Package Testing Data For PowerPAK TSC75-6L(Power IC only)
Package Reliability	Environmental and Package Testing Data for SOT-23
Package Reliability	Environmental and Package Testing Data for TDFN8 2 mm x 2 mm
Silicon Technology Reliability	VIS BCD Process Technology 200901 to 201103

Tape Info [top]
93-5219-1	Tape Drawing for SOT-23 5L/6L
93-5219-1	Tape Drawing for TSOT23-5L & 6L
93-5250-x	Tape Drawing for PowerPAK SC75-6L(Power IC only)
93-5276-X	Tape Drawing for TDFN4 1.2 x 1.6 CARRIER TAPE
93-5277-X	Tape Drawing for TDFN8 2.0 x 2.0 CARRIER TAPE
PACK-0007-21	Device Orientation PowerPAK® SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75
PACK-0007-25	Device Orientation - TDFN4 1.2 mm x 1.6 mm