Related Documents - Power ICs
Application Notes (29)
Markings (4)
Package Drawings (33)
Packaging Information (1)
Pad Guidelines (4)
Promotional Materials (6)
RC Thermal Models (1)
Reel Info (1)
Reliability Data (23)
Selector Guides (1)
Support Tools (21)
Tape Info (23)
SPICE (4)
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Application Notes
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|
 AN602 |
Driver Ics for Automotive Diagnostic Communications Meet ISO9141 Stndards |
| AN603 |
Designing With the Si9978DW Configurable H-Bridge Controller |
| AN701 |
Designing High-Frequency DC-to-DC Converters with the Si9114A Switchmode Controller |
| AN702 |
Efficient ISDN Power Converters Using the Si9100 |
| AN703 |
Designing DC/DC Converters with the Si9110 Switchmode Controller |
| AN704 |
Designing DC/DC Converters to Meet CCITT Specifications for ISDN Terminals |
| AN705 |
Si9910 Adaptive Power MOSFET Driver Improves Performance in High-Voltage Half-Bridge Applications |
| AN707 |
Designing Low-Power Off-Line Flyback Converters, using the Si9120 switchmode controller IC |
| AN708 |
Low-Power Universal-Input Power Supply Achieves High Efficiency |
| AN709 |
Designing with the Si9976DY N-Channel Half-Bridge Driver and LITTLE FOOT Dual MOSFETs |
| AN710 |
High-Efficiency Buck Converter for Notebook Computers |
| AN713 |
A 1-Watt Flyback Converter Using the Si9100 |
| AN714 |
A Compact Controller for Brushless DC Motors |
| AN715 |
Designing Low-Voltage DC/DC Converters with the Si9145 |
| AN716 |
Designing with Siliconix PC Card (PCMCIA) Power Interface Switches |
| AN718 |
Powering the Pentium VRE with the Si9145 Voltage Mode Controlled PWM Converter |
| AN720 |
Si9986 Buffered H-Bridge |
| AN723 |
Design A High Performance Buck or Boost Converter with Si9165 |
| AN724 |
Designing A High-Frequency, Self-Resonant Reset Forward DC/DC For Telecom Using Si9118/9 PWM/PSM Controller |
| AN725 |
Si9136: Novel Triple-Converter Controller |
| AN726 |
Design High Frequency, Higher Power Converters with Si9166 |
| AN727 |
High-Frequency, High-Efficiency Buck Converter Design for Multi-Cell Battery Configured Systems Using Si9167 |
| AN728 |
Designing A Flyback Converter with Si9113 for Feeding the TE from U-Interface In ISDN |
| AN729 |
Designing A High-Frequency, Higher-Power Buck/Boost Converter for Multi-Cell Input Configurations Using Si9168 |
| AN730 |
Designing A Wide Input Range DCM Flyback Converter Using the Si9108 |
| AN732 |
Designing A High-Voltage Non-isolated Buck-Boost Converter with the Si9121DY |
| AN737 |
Si9988 Buffered H-Bridge |
| AN738 |
Design of A Small, Efficient, Isolated Flyback Converter for 24V Input Systems with Si9121 |
| AN739 |
Designing with the Si9174, Si9175 and Si9176 Family of High-Performance Synchronous Step-Down Converters |
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Markings
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| PART MARKING |
PowerPAK MLF 10 x 10 |
| PART MARKING |
PowerPAKŪ MLF 9 x 9 |
| PART MARKING |
SO-14, SO-16, S0-20, S0-24, and SO-28 Narrow and Wide Body Devices |
| Part Marking Information |
MICR FOOT |
|
Package Drawings
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|
| 5300 |
SOIC-16 (Narrow) |
| 5498 |
SOIC-8 (Narrow) |
| 5624 |
TSSOP-16 |
| 5891 |
SC-89 (SOT-666) 6L |
| 5905 |
PowerPAK MLP44-16 Package Outline (Power IC Only) |
| 5908 |
TSSOP: 8-Lead Package Outline (Power IC Only) |
| 5910 |
SOIC: 16-Lead (Wide-Body) Package Outline (Power IC Only) |
| 5912 |
SOIC: 16-Lead (Narrow-Body) Package Outline (Power IC Only) |
| 5913 |
TSSOP: 14/16-Lead Thermally Enhanced PowerPak Package Outline (Power IC Only) |
| 5914 |
SOIC: 14-Lead (Narrow-Body) Package Outline (Power IC Only) |
| 5915 |
SSOP: 28-Lead (5.3 mm) Package Outline (Power IC Only) |
| 5917 |
PLCC: 20-Lead Package Outline (Power IC Only) |
| 5918 |
PDIP: 8-Lead Package Outline (Power IC Only) |
| 5919 |
PDIP: 14-Lead Package Outline (Power IC Only) |
| 5920 |
PDIP: 16-Lead Package Outline (Power IC Only) |
| 5922 |
MSOP: 10-Lead Package Outline (Power IC Only) |
| 5923 |
TSSOP: 20-Lead Package Outline (Power IC Only) |
| 5924 |
MLP33-10 Package Outline (Power IC Only) |
| 5925 |
PowerPAK MLP33-6, 8, 10 Package Outline (Power IC Only) |
| 5926 |
Thin SOT-23: 5- and 6-Lead Package Outline (Power IC Only) |
| 5928 |
SQFP: 48-Lead (7x7x1.4 mm) Square Package Outline (Power IC Only) |
| 5930 |
SOIC: 24-Lead (Wide-Body) Package Outline (Power IC Only) |
| 5939 |
PowerPAK MLP65: 18/20-Lead Package Outline (Power IC Only) |
| 5941 |
SC-70: 3/4/5/6-Lead Package Outline (Power IC Only) |
| 5944 |
PowerPAK MLF 10 x 10 |
| 5948 |
PowerPAK MLF 9x9 |
| 5953 |
PowerPAK SC75-6L (Power IC only) |
| 5955 |
PowerPAK TSC75-6 (Power IC Only) |
| 5983 |
PowerPAK MLPQ55-32L |
| 5986 |
PowerPAK MLP66-40L |
| 5996 |
PowerPAKŪ MLP44-28L Case Outline |
| 5997 |
TDFN8 2x2 |
| Package Information |
TDFN4 1.2 x 1.6 Case Outline |
|
Packaging Information
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|
| Package Information |
WCSP4: 4 Bumps |
|
Pad Guidelines
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|
| PAD Pattern |
PowerPAK MLP44-28L Land Pattern |
| PAD Pattern |
SO-16 |
| PAD Pattern |
TFDN4 1.2 x 1.6 |
| PAD Pattern |
TSSOP-16 |
|
Promotional Materials
|
|
| Product Overview |
microBUCK Product Family |
| Product Overview |
ThermaSim Thermal Simulation Tool |
| Product Sheet |
SiC769, SiC769A, SiC762 Integrated DrMOS Power Stage |
| Product Sheet |
SiC779CD Integrated DrMOS Power Stage |
| Selector Guide |
Power ICs |
| Users Guide |
Vishay PowerCAD Online Simulation Tool |
|
RC Thermal Models
|
|
| Si4724CY-RC |
RC Thermal Model for Si4724CY |
|
Reel Info
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|
| Reel Information |
Lok Reel |
|
Reliability Data
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|
| Package Reliability |
Environmental and Package Testing Data For MLP-65 |
| Package Reliability |
Environmental and Package Testing Data For MLP/QFN |
| Package Reliability |
Environmental and Package Testing Data For MSOP |
| Package Reliability |
Environmental and Package Testing Data For PDIP 8-28 Lead |
| Package Reliability |
Environmental and Package Testing Data For PLCC |
| Package Reliability |
Environmental and Package Testing Data For PowerPAK TSC75-6L(Power IC only) |
| Package Reliability |
Environmental and Package Testing Data For PowerPAK TSSOP-16 |
| Package Reliability |
Environmental and Package Testing Data for SC-89 |
| Package Reliability |
Environmental and Package Testing Data For SC70-5L(Power IC only) |
| Package Reliability |
Environmental and Package Testing Data for SO-8 |
| Package Reliability |
Environmental and Package Testing Data For SOIC 14-28 Lead |
| Package Reliability |
Environmental and Package Testing Data for SOT-23 |
| Package Reliability |
Environmental and Package Testing Data For SQFP 48-64 Lead |
| Package Reliability |
Environmental and Package Testing Data For SSOP 20-28 Lead |
| Package Reliability |
Environmental and Package Testing Data for TDFN8 2 mm x 2 mm |
| Package Reliability |
Environmental and Package Testing Data For TSSOP 14-28 Lead |
| Package Reliability |
Environmental and Package Testing Data for TSSOP-8 |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
Accelerated Operating Life Test Result |
| Silicon Technology Reliability |
VIS BCD Process Technology 200901 to 201103 |
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Selector Guides
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|
| Selector Guide |
Power ICs |
|
Support Tools
|
|
| SI786DB |
Demo Board Documentation of Si786 |
| SI9113DB |
Demo Board Documentation of Si9113 |
| SI9118DB |
Demo Board Documentation of Si9118 |
| SI9119DB |
Demo Board Documentation of Si9119 |
| SI9121DB |
Demo Board Documentation of Si9121 |
| SI9122DB |
Demo Board Documentation of Si9122 |
| SI9130DB |
Demo Board Documentation of Si9130 |
| SI9136DB |
Demo Board Documentation of Si9136 |
| SI9140DB |
Demo Board Documentation of Si9140 |
| SI9160DB |
Demo Board Documentation of Si9160 |
| SI9161DB |
Demo Board Documentation of Si9161 |
| SI9165DB |
Demo Board Documentation of Si9165 |
| SI9166DB |
Demo Board Documentation of Si9166 |
| SI9167DB |
Demo Board Documentation of Si9167 |
| SI9168DB |
Demo Board Documentation of Si9168 |
| SI9169DB |
Demo Board Documentation of Si9169 |
| SiC413DB |
Demo Board Documentation of SiC413 |
| SiDB766707 |
SiC714CD10 MOSFET Plus Driver Evaluation Board |
| SiP11203DB |
Demo Board Documentation of SiP11203 |
| SiP11205/SiP11206DB |
Demo Board Documentation of SiP11205/SiP11206 |
| SiP11206DB |
200 W 1/16th Brick IBC Demo Board using SiP11206 |
| SIP1759DB |
Demo Board Documentation of SIP1759 |
|
Tape Info
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|
| 90-2345-X |
Tape Drawing for TSSOP: 8 Lead (16 mm) |
| 90-2347-x |
Tape Drawing for TSSOP-14, 16/PowerPAK TSSOP-16 |
| 91-2344-1 |
Tape Drawing for SSOP-28 |
| 91-5209-x |
Tape Drawing for SOIC PACKAGES (NARROW AND WIDE BODY) |
| 93-5216-1 |
Tape Drawing for MSOP-10 |
| 93-5219-1 |
Tape Drawing for SOT-23 5L/6L |
| 93-5219-1 |
Tape Drawing for TSOT23-5L & 6L |
| 93-5227-1 |
Tape Drawing for MLP33-6, 8, 10 and PowerPak MLP33-6, 8, 10 |
| 93-5232-X |
Tape Drawing for SC-89 (SOT-666) 6-LEAD |
| 93-5243-x |
Tape Drawing for MLP65-18/20L |
| 93-5250-x |
Tape Drawing for PowerPAK SC75-6L(Power IC only) |
| 93-5260-x |
Tape Drawing for MLP55-28L/32L |
| 93-5266 |
Tape Drawing for MLP 6 x 6 CARRIER TAPE |
| 93-5276-X |
Tape Drawing for TDFN4 1.2 x 1.6 CARRIER TAPE |
| 93-5277-X |
Tape Drawing for TDFN8 2.0 x 2.0 CARRIER TAPE |
| PACK-0007-11 |
Device Orientation for SC70-5L and TSOP-5L (T1) |
| PACK-0007-19 |
Device Orientation for MLP65-20L, MLP55-28, 32L |
| PACK-0007-20 |
Device Orientation for MLF9x9, MLF10x10, MLP6x6 |
| PACK-0007-21 |
Device Orientation PowerPAKŪ SC-70, PowerPAK SC-75,Thin PowerPAK SC-70, Thin PowerPAK SC-75 |
| PACK-0007-25 |
Device Orientation - TDFN4 1.2 mm x 1.6 mm |
| PACK-0007-6 |
Device Orientation for MSOP, SOIC, SSOP, and TSSOP (T1) |
| PACK-0007-8/9 |
Device Orientation for SC70-6L, SC89-6L, TSOP-6 (Single, Dual, Complementary or Dual Symmetrical) (T1) |
| PACK-0012 |
Device Orientation for PLCC-20/28/44 (T1) |
| Tape Information |
Tape Drawing for PowerPAKŪ, MLP(QFN), 4 x 4/3 x 3, DFN-10, 3 x 3, MLP33-8/10 |
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SPICE
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|||||
| H-Spice Model | I-Spice Model | P-Spice Model (*.txt) | Spice Model (pdf) | ||
 Si4724CY-H |
|
Si4724CY-P |
Si4724CY-DS |
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