CSD PRODUCT INFORMATION

Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)
vsh-img-product-image

FEATURES

Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
Monolithic construction
Ceramic package with no cavity. 4 pins to 20 pins.


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Showing 1 to 8 of 8 entries
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Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)
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