Si8457DB product information
P-Channel 12 V (D-S) MOSFET
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Datasheet
General Information
General Information - Useful Web Links
Markings
Part Marking Information - MICRO FOOT®
Package Drawings
Package Information - MICRO FOOT: 4-Bumps (1.6 mm x 1.6 mm, 0.8 mm Pitch, 0.290 mm Bump Height)
Pad Guidelines
PAD Pattern - MICRO FOOT Products
Reel Info
Reliability Data
Package Reliability - Environmental and Package Testing Data for MICRO FOOT®
Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result
Tape Info
PACK-0023-1 - Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
Tape Information - MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
SPICE Models (*.pdf)
Si8457DB-DS - DS-SPICE Model for Si8457DB
SPICE Models (*.zip)
Si8457DB-zip - SPICE Models for Si8457DB
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