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BU2006, BU2008, BU2010 product information

Enhanced isoCink+™ Bridge Rectifiers

 BU2006, BU2008, BU2010 Datasheet

FEATURES

  • UL recognition file number E312394
  • Thin single in-line package
  • Glass passivated chip junction


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Documents

Datasheet
Application Notes
Application Note - Design Guidelines for Schottky Rectifiers
Application Note - Fundamentals of Rectifiers
Application Note - High Speed Data Line Protection Low Current Bridges Rectifiers Lend Themselves to Data Line Protection
Application Note - Physical Explanation
Application Note - Power Factor Correction with Ultrafast Diodes
Application Note - Rectifiers for Power Factor Correction (PFC)
Application Note - SUPERECTIFIER® Design Brings New Level of Reliability to Surface Mount Components
Markings
Product Literature
Infograph - eSMP® シリーズ パワーダイオード製品の小型・薄型パッケージソリューション - In a Nutshell
Infograph - eSMP® 系列 用于选定二极管和整流器的小尺寸和低型面高度封装解决方案 - 快速了解
Reference Data
Pad Layouts/Soldering Process - Vishay General Semiconductor Recommended Minimum Mounting Pad Layout Sizes For The Surface Mount Rectifier
Tape and Reel Info
Packaging Information - Packaging Information
Product Support
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Part Description
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Project Name
Estimated Annual Use
Customer Material Number
Start of Production
 
Notes


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