Si8409DB product information

P-Channel 30 V (D-S) MOSFET
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General Information
General Information - Useful Web Links
Part Marking Information - MICRO FOOT®
Package Drawings
Package Information - MICRO FOOT: 4-Bumps (1.6 mm x 1.6 mm, 0.8 mm Pitch, 0.290 mm Bump Height)
Pad Guidelines
PAD Pattern - MICRO FOOT Products
RC Thermal Models
Si8409DB-RC - RC Thermal Model for Si8409DB
Reel Info
Reliability Data
Package Reliability - Environmental and Package Testing Data for MICRO FOOT®
Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result
Tape Info
PACK-0023-1 - Device Orientation for MOSFETs, MICRO FOOT 2x2: 0.8-mm Pitch, 0.275-mm Bump Height (T1)
Tape Information - MICRO FOOT® 2 x 2: 0.8 mm PITCH, 0.275 mm BUMP HEIGHT (Si8401DB-T1, Si8402DB-T1, Si8405DB-T1, and Si8411DB-T1)
SPICE Models (*.pdf)
Si8409DB-DS - DS-Spice Model for Si8409DB
HSPICE Models (*.txt)
si8409db-h - H-Spice Model for Si8409DB
PSpice Models (*.lib)
si8409db-p lib - LIB for P-Spice Model for Si8409DB
PSpice Models (*.olb)
si8409db-p olb - OLB for P-Spice Model for Si8409DB
PSpice Models (*.txt)
si8409db-p - P-Spice Model for Si8409DB
Product Support
Technical Questions
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