| CS Networks |  | Thin Film | Ceramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom)) | 50 | 0.02 | 0.1 | | 20 | 500 K |
| 10 | 0.01 | 2 M |
| CSD | | Thin Film | Dual-In-Line, Ceramic Sandwich Custom | 10 | 0.01 | 0.1 | | | |
| 0.5 |
| CSO | | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| 0.5 |
| CTSP | | Thin Film | Single-In-Line Molded 6-10 Pin Custom | 10 | 0.025 | 0.1 | | 20 | 500 K |
| 25 |
| 500 |
| DIP: 1442, 1445, 1446 | | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1457 | | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1460 | | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DSM | | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Surface Mount Molded Voltage Divider | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| FP200, 201, 202 | | Thin Film | Hermetic Flat-Packs | 10 | 0.01 | 0.8 | | | |
| 70 |
| HD (Custom) | | Thin Film | Dual-In-Line Heremtic Custom | 10 | 0.02 | 0.1 | | 50 | 0 |
| LCC/TLCC | | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.5 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| MP | | Thin Film | Surface Mount Network | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA | | Thin Film | SOT-143, 2 isolated Resistor Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MR | | Metal Film or Wirewound | Resistor Networks, Wirewound or Metal Film Technologies | 50 | 0.1 | 0.1 | | 0.1 | 10 M |
| NOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | 10 | 0.025 | 0.05 | | 100 | 500 K |
| 0.4 |
| 0.5 |
| ORN | | Thin Film | SOIC, 8 pin 4 Resistor | 25 | 0.025 | 0.1 | | | |
| 0.4 |
| Quick-Net® Prototypes | | Thin Film | Guidelines | 25 | 0.1 | 0.025 | | 100 | 55 K |
| 200 | 120 K |
| 400 | 250 K |
| RMKD (CNP) | | Thin Film | Hermetic, Dual-In-Line Packaged Resistor Networks | 0 | 0.1 | 0.125 | | 5000000. | 0. |
| RMKMS (CNM) | | Thin Film | Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks | 0 | 0.1 | 0.25 | | 5000000. | 2000000000. |
| SLCC | | Thin Film | Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks | 0 | 0.1 | 0.5 | | | |
| SLR | | Thin Film | Single Layer Resistor Carrier Networks | 50 | 0.05 | | | 10 | 500 K |
| TAS (CNS) | | Thin Film | Conformal, Single-In-Line Resistor Networks | 0 | 0.1 | | | | |
| TDP | | Thin Film | Dual-In-Line Molded 14-16 Pin Standard | 25 | 0.01 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.8 |
| TO: 1401 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1403 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1413 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1417 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1419 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1421 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1422 | | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.75 |
| 1 |
| TSP | | Thin Film | Single-In-Line Molded 6, 8, 10 Pin Standards Standard | 25 | 0.05 | 0.1 | | 100 | 200 K |
| 0.5 |
| 25 |
| VFB1012D (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) | | Bulk Metal Foil | Hermetic Resistor Networks in Gull Wing Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSM85, 86, 87, 88, 89 | | Bulk Metal Foil | Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration | 2 | 0.005 | | | 5 | 80 K |
| VTF (Custom) | | Thin Film | Single-In-Line Conformal Custom | 10 | 0.01 | 0.1 | | 20 | 2 M |
| VTF (Standard) | | Thin Film | Single-In-Line Conformal, 3-10 Pin Standards | 10 | 0.001 | | | | |
| WOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | 25 | 0.05 | 0.05 | | 100 | 500 K |
| 0.5 |
| 1 |
| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
