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Products A-Z:Resistor networks> Resistor networks>Resistance 10 to 10K Ohms (41 datasheets)
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Resistor networks: Resistor networks - Resistance 10 to 10K Ohms
TypeResistor Networks
BrandsVishay Dale, Vishay Electro-Films, Vishay Foil Resistors, Vishay Sfernice, Vishay Thin Film

All 41 datasheets shown.
SeriesTechnologyDescriptionTypical TCR (ppm/C)Min. tolerance (%)Power (W)Case (EIA & Mil)Resistance (min) (Ohms)Resistance (max) (Ohms)
CS NetworksinfoThin FilmCeramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom))1000.020.1 20 500 K
100.01 2 M
CSCinfoThick FilmThick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack10010.2 10 2.2 M
0.25
0.3
0.4
CSOinfoThin FilmSOIC, Ceramic Sandwich Custom Resistor Networks 250.020.1 100 1.5 M
0.5
CTSPinfoThin FilmSingle-In-Line Molded 6-10 Pin Custom100.0250.1 20 500 K
25
500
DFP14 and DFP16infoThick FilmMilitary, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test1002 10 1 M
DIP: 1442, 1445, 1446infoBulk Metal FoilCeramic Dual In Line Package20.005 5 80 K
DIP: 1457infoBulk Metal FoilCeramic Dual In Line Package20.005 5 80 K
DIP: 1460infoBulk Metal FoilCeramic Dual In Line Package20.005 5 80 K
DSMinfoBulk Metal FoilHigh Precision Surface Mount Molded Voltage Divider20.010.1 100 20 K
DSMZ (Z-Foil)infoBulk Metal FoilUltra High Precision Surface Mount Molded Voltage Divider0.050.010.1 100 10 K
HDinfoThin FilmHermetic, Dual-In-Line Resistor Networks (Custom)0.02 50 50
MDP14 and MDP16infoThick Film, MoldedDual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack10010.125 10 2.2 M
0.25
MPinfoThin FilmSurface Mount Network250.10.15 250 50 K
MPD/MPDAinfoThin FilmSOT-143, 2 isolated Resistor Divider 250.050.1 500 100 K
0.2
MRinfoMetal Film or WirewoundResistor Networks, Wirewound or Metal Film Technologies500.10.1 0.1 10 M
MSPinfoThick FilmSingle Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible10010.2 10 2.2 M
0.25
0.3
0.4
NOMCinfoThin FilmDual In Line, SOIC , 14-16 Pin Narrow Body Molded 100.0250.05 100 500 K
0.4
0.5
Quick-Net® PrototypesinfoThin FilmGuidelines250.10.025 100 55 K
200 120 K
400 250 K
RCNinfoThin FilmThin Film Filter Networks1000000.2500000.
RMKMS (CNM)infoThin FilmMolded, 50 Mil Pitch, Dual-In-Line Resistor Networks00.10.255000000.2000000000.
SIL-HRinfoThick FilmHigh Reliability Network Resistors, Thick Film Technology20.1 46.4 1 M
0.18
0.5
0.7
0.8
0.9
SLRinfoThin FilmSingle Layer Resistor Carrier Networks 500.05 10 500 K
SOGC 01,03,05 SchematicsinfoThick FilmDual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics10011.6 10 1 M
2
SOGC, 45 and 46 SchematicsinfoThick FilmDual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics10021.6 150 150
180 180
270 270
330 330
820 820
2 150 150
180 180
270 270
330 330
820 820
SOMCinfoThick FilmDual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs,10010.08 10 1 M
0.16
TDPinfoThin FilmDual-In-Line Molded 14-16 Pin Standard250.010.05 100 100 K
0.1
0.8
TO: 1401infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1403infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1413infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1417infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1419infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1421infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TO: 1422infoBulk Metal FoilGlass to Metal Seal Headers20.005 5 80 K
TOMCinfoThin FilmDual In Line, SOIC , 14-16 Pin Medium Body Molded 250.0250.05 100 100 K
0.1
0.75
1
TSPinfoThin FilmSingle-In-Line Molded 6, 8, 10 Pin Standards Standard250.050.1 100 200 K
0.5
25
VFB1012D (Z-Foil)infoBulk Metal FoilUltra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor0.050.010.21012 1000 10 K
VSM40, 42, 45, 46 (8, 14, and 16 Pin Side)infoBulk Metal FoilHermetic Resistor Networks in Gull Wing Configuration20.005 5 80 K
VSM85, 86, 87, 88, 89infoBulk Metal FoilHermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration20.005 5 80 K
VSOR2000S1infoThin FilmSOIC, V35 Terminator 1000.51.6 50 125
VTF (Custom)infoThin FilmSingle-In-Line Conformal Custom100.010.1 20 2 M
WOMCinfoThin FilmDual In Line, SOIC , 14-16 Pin Wide Body Molded 250.050.05 100 500 K
0.5
1
SeriesTechnologyDescriptionTypical TCR (ppm/C)Min. tolerance (%)Power (W)Case (EIA & Mil)Resistance (min) (Ohms)Resistance (max) (Ohms)
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