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Series Technology Description Typical TCR (ppm/C) Min. tolerance (%) Power (W) Resistance (min) (Ohms) Resistance (max) (Ohms)
CS Networks Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom)) 50 0.02 0.1 20 500 K
10 0.01 2 M
CSC Thick Film Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack 100 1 0.2 10 2.2 M
0.25
0.3
0.4
CSO Thin Film SOIC, Ceramic Sandwich Custom Resistor Networks 25 0.02 0.1 100 1.5 M
0.5
CTSP Thin Film Single-In-Line Molded 6-10 Pin Custom 10 0.025 0.1 20 500 K
25
500
DFM14 Thick Film Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test 100 2 0.025 10 1 M
0.05
DFP14 and DFP16 Thick Film Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test 50 2 10 1 M
DIP: 1442, 1445, 1446 Bulk Metal Foil Ceramic Dual In Line Package 2 0.005 5 80 K
DIP: 1457 Bulk Metal Foil Ceramic Dual In Line Package 2 0.005 5 80 K
DIP: 1460 Bulk Metal Foil Ceramic Dual In Line Package 2 0.005 5 80 K
DSM Bulk Metal Foil High Precision Surface Mount Molded Voltage Divider 2 0.01 0.1 100 20 K
LCC/TLCC Thin Film Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard 25 0.1 0.05 10 120 K
200 K
250 K
100 100 K
1000
110 K
0.1 10 120 K
200 K
250 K
100 100 K
1000
110 K
0.5 10 120 K
200 K
250 K
100 100 K
1000
110 K
MDM14 and MDM16 Thick Film, Molded Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics 100 1 0.1 10 1 M
0.2
MDP14 and MDP16 Thick Film, Molded Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack 100 1 0.125 10 2.2 M
0.25
MP Thin Film Surface Mount Network 25 0.1 0.15 250 50 K
MPD/MPDA Thin Film SOT-143, 2 isolated Resistor Divider 25 0.05 0.1 500 100 K
0.2
MR Metal Film or Wirewound Resistor Networks, Wirewound or Metal Film Technologies 50 0.1 0.1 0.1 10 M
MSM Thick Film Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Single-In-Line, Molded SIP; 01, 03, 05 Schematics 100 2 0.36 10 1 M
0.48
0.6
0.8
0.84
1
1.08
1.4
1.8
MSP Thick Film Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible 100 1 0.2 10 2.2 M
0.25
0.3
0.4
NOMC Thin Film Dual In Line, SOIC , 14-16 Pin Narrow Body Molded 10 0.025 0.05 100 500 K
0.4
0.5
Quick-Net® Prototypes Thin Film Guidelines 25 0.1 0.025 100 55 K
200 120 K
400 250 K
RMKMS (CNM) Thin Film Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks 0 0.1 0.25 5000000. 2000000000.
SIL-HR Thick Film High Reliability Network Resistors, Thick Film Technology 2 0.1 46.4 1 M
0.18
0.5
0.7
0.8
0.9
SLR Thin Film Single Layer Resistor Carrier Networks 50 0.05 10 500 K
SOGC 01,03,05 Schematics Thick Film Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics 100 1 1.6 10 1 M
2
SOMC Thick Film Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, 100 1 0.08 10 1 M
0.16
TDP Thin Film Dual-In-Line Molded 14-16 Pin Standard 25 0.01 0.05 100 100 K
0.1
0.8
TO: 1401 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1403 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1413 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1417 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1419 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1421 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TO: 1422 Bulk Metal Foil Glass to Metal Seal Headers 2 0.005 5 80 K
TOMC Thin Film Dual In Line, SOIC , 14-16 Pin Medium Body Molded 25 0.025 0.05 100 100 K
0.1
0.75
1
TSP Thin Film Single-In-Line Molded 6, 8, 10 Pin Standards Standard 25 0.05 0.1 100 200 K
0.5
25
VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) Bulk Metal Foil Hermetic Resistor Networks in Gull Wing Configuration 2 0.005 5 80 K
VSM85, 86, 87, 88, 89 Bulk Metal Foil Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration 2 0.005 5 80 K
VTF (Custom) Thin Film Single-In-Line Conformal Custom 10 0.01 0.1 20 2 M
WOMC Thin Film Dual In Line, SOIC , 14-16 Pin Wide Body Molded 25 0.05 0.05 100 500 K
0.5
1
Series Technology Description Typical TCR (ppm/C) Min. tolerance (%) Power (W) Resistance (min) (Ohms) Resistance (max) (Ohms)
