| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | |
| CSO |  | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| 0.5 |
| DSM | | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Surface Mount Molded Voltage Divider | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| FP200, 201, 202 | | Thin Film | Hermetic Flat-Packs | 10 | 0.01 | 0.8 | | | |
| 70 |
| LCC/TLCC | | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.5 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| MP | | Thin Film | Surface Mount Network | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA | | Thin Film | SOT-143, 2 isolated Resistor Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| | | | |
| NOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | 10 | 0.025 | 0.05 | | 100 | 500 K |
| 0.4 |
| 0.5 |
| ORN | | Thin Film | SOIC, 8 pin 4 Resistor | 25 | 0.025 | 0.1 | | | |
| 0.4 |
| SLR | | Thin Film | Single Layer Resistor Carrier Networks | 50 | 0.05 | | | 10 | 500 K |
| SOGC 01,03,05 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 100 | 1 | 1.6 | | 10 | 1 M |
| 2 |
| SOGC, 45 and 46 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 100 | 2 | 1.6 | | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| 2 | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| | | Zero ohm jumper | Zero ohm jumper |
| |
| TOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.75 |
| 1 |
| VFB1012D (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) | | Bulk Metal Foil | Hermetic Resistor Networks in Gull Wing Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSM85, 86, 87, 88, 89 | | Bulk Metal Foil | Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSOR2000S1 | | Thin Film | SOIC, V35 Terminator | 100 | 0.5 | 1.6 | | 50 | 125 |
| WOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | 25 | 0.05 | 0.05 | | 100 | 500 K |
| 0.5 |
| 1 |
| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
|
