| DIP: 1442, 1445, 1446 |  | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1457 |  | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1460 |  | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DSM |  | High Precision Surface Mount Molded Voltage Divider | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) |  | Ultra High Precision Surface Mount Molded Voltage Divider | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| TO: 1401 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1403 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1413 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1417 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1419 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1421 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1422 |  | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| VFB1012D (Z-Foil) |  | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) |  | Hermetic Resistor Networks in Gull Wing Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSM85, 86, 87, 88, 89 |  | Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration | 2 | 0.005 | | | 5 | 80 K |
| Series | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |