| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | |
| CSC |  | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| DFP14 and DFP16 | | Thick Film | Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test | 100 | 2 | | | 10 | 1 M |
| MDP14 and MDP16 | | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | 100 | 1 | 0.125 | | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MDP16-45 and MDP16-46 | | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| MSP | | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| SIL-HR | | Thick Film | High Reliability Network Resistors, Thick Film Technology | | 2 | 0.1 | | 46.4 | 1 M |
| 0.18 |
| 0.5 |
| 0.7 |
| 0.8 |
| 0.9 |
| SOGC 01,03,05 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 100 | 1 | 1.6 | | 10 | 1 M |
| 2 |
| SOGC, 45 and 46 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 100 | 2 | 1.6 | | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| 2 | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| | | Zero ohm jumper | Zero ohm jumper |
| |
| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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