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| Resistor networks: Power 1W or below - Resistor networks |
| Type | Resistor Networks |
| Brands | Vishay Dale, Vishay Electro-Films, Vishay Foil Resistors, Vishay Sfernice, Vishay Techno, Vishay Thin Film |
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| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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| CS Networks |  | Thin Film | Ceramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom)) | 50 | 0.02 | 0.1 | | 20 | 500 K |
| 10 | 0.01 | 2 M |
| CSC | | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| CSD | | Thin Film | Dual-In-Line, Ceramic Sandwich Custom | 10 | 0.01 | 0.1 | | | |
| 0.5 |
| CSO | | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| 0.5 |
| CTSP | | Thin Film | Single-In-Line Molded 6-10 Pin Custom | 10 | 0.025 | 0.1 | | 20 | 500 K |
| DSM | | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Surface Mount Molded Voltage Divider | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| FP200, 201, 202 | | Thin Film | Hermetic Flat-Packs | 10 | 0.01 | 0.8 | | | |
| HD (Custom) | | Thin Film | Dual-In-Line Heremtic Custom | 10 | 0.02 | 0.1 | | 50 | 0 |
| LCC/TLCC | | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
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| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.5 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
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| MDP14 and MDP16 | | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | 100 | 1 | 0.125 | | 10 | 2.2 M |
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| 0.25 | 10 | 2.2 M |
| MDP16-45 and MDP16-46 | | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| MP | | Thin Film | Surface Mount Network | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA | | Thin Film | SOT-143, 2 isolated Resistor Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MR | | Metal Film or Wirewound | Resistor Networks, Wirewound or Metal Film Technologies | 50 | 0.1 | 0.1 | | 0.1 | 10 M |
| MSP | | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| NOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | 10 | 0.025 | 0.05 | | 100 | 500 K |
| 0.4 |
| 0.5 |
| ORN | | Thin Film | SOIC, 8 pin 4 Resistor | 25 | 0.025 | 0.1 | | | |
| 0.4 |
| Quick-Net® Prototypes | | Thin Film | Guidelines | 25 | 0.1 | 0.025 | | 100 | 55 K |
| 200 | 120 K |
| 400 | 250 K |
| RMKD (CNP) | | Thin Film | Hermetic, Dual-In-Line Packaged Resistor Networks | 0 | 0.1 | 0.125 | | 5000000. | 0. |
| RMKMS (CNM) | | Thin Film | Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks | 0 | 0.1 | 0.25 | | 5000000. | 2000000000. |
| SIL-HR | | Thick Film | High Reliability Network Resistors, Thick Film Technology | | 2 | 0.1 | | 46.4 | 1 M |
| 0.18 |
| 0.5 |
| 0.7 |
| 0.8 |
| 0.9 |
| SLCC | | Thin Film | Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks | | 0.1 | 0.5 | | | |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| T16L08 and T16LR8 | | Thin Film | Thick Film Resistor Networks, Dual-In-Line, 8 Bit | 0 | 2 | 0.05 | | 250000. | 0. |
| TDP | | Thin Film | Dual-In-Line Molded 14-16 Pin Standard | 25 | 0.01 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.8 |
| TOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.75 |
| 1 |
| TSP | | Thin Film | Single-In-Line Molded 6, 8, 10 Pin Standards Standard | 25 | 0.05 | 0.1 | | 100 | 200 K |
| 0.5 |
| VFB1012D (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VTF (Custom) | | Thin Film | Single-In-Line Conformal Custom | 10 | 0.01 | 0.1 | | 20 | 2 M |
| WOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | 25 | 0.05 | 0.05 | | 100 | 500 K |
| 0.5 |
| 1 |
| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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