| 100-267 |  | Thin Film | Single-In-Line Conformal, Five Decade Divider | Resistor Networks, Divider | 25 | 0.01 | 0.1 | | | |
| 300144 |  | Bulk Metal Foil | Small Package Molded Voltage Dividers, Pair | Resistor Networks, Divider | 2 | 0.005 | 0.2 | | 100 | 20 K |
| 300144Z (Z-Foil) |  | Bulk Metal Foil | Small Package Molded Voltage Dividers, Pair | Resistor Networks, Divider | 0.05 | 0.005 | 0.2 | | 100 | 20 K |
| CRCA12E & S |  | Thick Film | Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 2012 | 10 | 1 M |
| 2512 |
| CRCC1206 |  | Thick Film | Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 1206 | 10 | 1 M |
| CS Networks |  | Thin Film | Ceramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom)) | Resistor Networks | 50 | 0.02 | 0.1 | | 20 | 500 K |
| 10 | 0.01 | 2 M |
| CS206 |  | Thick Film | Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP, 4 to 18 pins available, X7R and COG capacitors available, Low cross talk, Custom design capability | Resistor/Capacitor Networks | 200 | 2 | 0.125 | | 10 | 1 M |
| CSC |  | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| CSD |  | Thin Film | Dual-In-Line, Ceramic Sandwich Custom | Resistor Networks | 10 | 0.01 | 0.1 | | | |
| CSO |  | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| CTSP |  | Thin Film | Single-In-Line Molded 6-10 Pin Custom | Resistor Networks | 10 | 0.025 | 0.1 | | 20 | 500 K |
| CZA04S & CZA06S |  | Thick Film | Surface Mount Chip Attenuator, Tolerance matching and temperature tracking superior to individual components, Maximum input power: 75 milliwatts for CZA06S; 40 milliwatts for CZA04S, Frequency range: DC to 3GHz | Attenuators | | | 0.04 | | | |
| 0.075 |
| DSM |  | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | Resistor Networks | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) |  | Bulk Metal Foil | Ultra High Precision Surface Mount Molded Voltage Divider | Resistor Networks | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| HD (Custom) |  | Thin Film | Dual-In-Line Heremtic Custom | Resistor Networks | 10 | 0.02 | 0.1 | | 50 | 0 |
| LCC/TLCC |  | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | Resistor Networks | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| MDP14 and MDP16 |  | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | Resistor Networks | 100 | 1 | 0.125 | | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MDP16-45 and MDP16-46 |  | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | Resistor Networks | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| MP |  | Thin Film | Surface Mount Network | Resistor Networks | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA |  | Thin Film | SOT-143, 2 isolated Resistor Divider | Resistor Networks | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MPH |  | Thin Film | Hermetic, 50 Mil Pitch, Leadless Chip Resistor Network | Resistors, Fixed | 0 | 1 | 0.25 | | 1000000. | 1000000. |
| MPM |  | Thin Film | SOT-23 Molded 2 resistor Center-Tap Precision Divider | Resistor Networks, Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MR |  | Metal Film or Wirewound | Resistor Networks, Wirewound or Metal Film Technologies | Resistor Networks | 50 | 0.1 | 0.1 | | 0.1 | 10 M |
| MSP |  | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| NOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | Resistor Networks | 10 | 0.025 | 0.05 | | 100 | 500 K |
| ORN |  | Thin Film | SOIC, 8 pin 4 Resistor | Resistor Networks | 25 | 0.025 | 0.1 | | | |
| Quick-Net® Prototypes |  | Thin Film | Guidelines | Resistor Networks | 25 | 0.1 | 0.025 | | 100 | 55 K |
| 200 | 120 K |
| 400 | 250 K |
| RMKD (CNP) |  | Thin Film | Hermetic, Dual-In-Line Packaged Resistor Networks | Resistor Networks | 0 | 0.1 | 0.125 | | 5000000. | 0. |
| RMKMS (CNM) |  | Thin Film | Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks | Resistor Networks | 0 | 0.1 | 0.25 | | 5000000. | 2000000000. |
| SIL-HR |  | Thick Film | High Reliability Network Resistors, Thick Film Technology | Resistor Networks | | 2 | 0.1 | | 46.4 | 1 M |
| 0.18 |
| SOMC |  | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | Resistor Networks | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| T16L08 and T16LR8 |  | Thin Film | Thick Film Resistor Networks, Dual-In-Line, 8 Bit | Resistor Networks | 0 | 2 | 0.05 | | 250000. | 0. |
| TDP |  | Thin Film | Dual-In-Line Molded 14-16 Pin Standard | Resistor Networks | 25 | 0.01 | 0.05 | | 100 | 100 K |
| 0.1 |
| TOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | Resistor Networks | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| TSP |  | Thin Film | Single-In-Line Molded 6, 8, 10 Pin Standards Standard | Resistor Networks | 25 | 0.05 | 0.1 | | 100 | 200 K |
| VFB1012D (Z-Foil) |  | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | Resistor Networks | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VFCD 1505 Integrated Construction (Z-Foil) |  | Bulk Metal Foil | Ultra Precision Flip Chip Resistor, Special Design | Networks | 0.05 | 0.01 | 0.1 | | 1000 | 10 K |
| VHD144 |  | Bulk Metal Foil | Hermetic Versions of the Molded Divider 300144 | Resistor Networks, Divider | 2 | 0.005 | 0.2 | | 100 | 20 K |
| VHD200 |  | Hermetic Sealed Oil Filled Voltage Divider Ultimate Ratio Match and TC Tracking Limit | 0.1 |
| VSR144 |  | Bulk Metal Foil | Industrial Grade Miniature Voltage Divider | Resistor Networks, Divider | 4 | 0.05 | 0.2 | | 100 | 20 K |
| VTF (Custom) |  | Thin Film | Single-In-Line Conformal Custom | Resistor Networks | 10 | 0.01 | 0.1 | | 20 | 2 M |
| WOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | Resistor Networks | 25 | 0.05 | 0.05 | | 100 | 500 K |
| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |