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Series Technology Description Type Typical TCR (ppm/C) Min. tolerance (%) Power (W) Case (EIA & Mil) Resistance (min) (Ohms) Resistance (max) (Ohms)
CRCA12E & S Thick Film Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination Resistor/Capacitor Networks 200 5 0.125 2012 10 1 M
2512
CRCC1206 Thick Film Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size Resistor/Capacitor Networks 200 5 0.125 1206 10 1 M
CS206 Thick Film Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP, 4 to 18 pins available, X7R and COG capacitors available, Low cross talk, Custom design capability Resistor/Capacitor Networks 200 2 0.125 10 1 M
0.8
0.9
1
CSC Thick Film Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack Resistor Networks 100 1 0.2 10 2.2 M
0.25
0.3
0.4
CZA04S & CZA06S Thick Film Surface Mount Chip Attenuator, Tolerance matching and temperature tracking superior to individual components, Maximum input power: 75 milliwatts for CZA06S; 40 milliwatts for CZA04S, Frequency range: DC to 3GHz Attenuators 0.04
0.075
MDP14 and MDP16 Thick Film, Molded Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack Resistor Networks 100 1 0.125 10 2.2 M
0.25 10 2.2 M
MDP16-45 and MDP16-46 Thick Film, Molded Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Resistor Networks 100 2 0.125 MDP1645
150 5 MDP1646
MSP Thick Film Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible Resistor Networks 100 1 0.2 10 2.2 M
0.25
0.3
0.4
SIL-HR Thick Film High Reliability Network Resistors, Thick Film Technology Resistor Networks 2 0.1 46.4 1 M
0.18
0.5
0.7
0.8
0.9
SOMC Thick Film Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Resistor Networks 100 1 0.08 10 1 M
0.16
Series Technology Description Type Typical TCR (ppm/C) Min. tolerance (%) Power (W) Case (EIA & Mil) Resistance (min) (Ohms) Resistance (max) (Ohms)
