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| Resistor networks: Resistance tolerance <= 1 - Resistor networks |
| Type | Resistor Networks |
| Brands | Vishay Dale, Vishay Electro-Films, Vishay Foil Resistors, Vishay Sfernice, Vishay Techno, Vishay Thin Film |
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| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |   |  |   |   |   |   |   |   |
| CS Networks |  | Thin Film | Ceramic Sandwich, Single-In-Line Resistor Networks (Low profile 0.20 Custom)) | 50 | 0.02 | 0.1 | | 20 | 500 K |
| 10 | 0.01 | 2 M |
| CSC |  | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| CSD |  | Thin Film | Dual-In-Line, Ceramic Sandwich Custom | 10 | 0.01 | 0.1 | | | |
| 0.5 |
| CSO |  | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| 0.5 |
| CTSP |  | Thin Film | Single-In-Line Molded 6-10 Pin Custom | 10 | 0.025 | 0.1 | | 20 | 500 K |
| 25 |
| 500 |
| Custom Networks |  | Thin Film | Thick Film Networks, Molded SIPs, DIPs, and Coated SIPs | | 0.5 | | | 10000. | 10000. |
| DIP: 1442, 1445, 1446 |  | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1457 |  | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DIP: 1460 |  | Bulk Metal Foil | Ceramic Dual In Line Package | 2 | 0.005 | | | 5 | 80 K |
| DSM |  | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | 2 | 0.01 | 0.1 | | 100 | 20 K |
| DSMZ (Z-Foil) |  | Bulk Metal Foil | Ultra High Precision Surface Mount Molded Voltage Divider | 0.05 | 0.01 | 0.1 | | 100 | 10 K |
| FP200, 201, 202 |  | Thin Film | Hermetic Flat-Packs | 10 | 0.01 | 0.8 | | | |
| 70 |
| HD (Custom) |  | Thin Film | Dual-In-Line Heremtic Custom | 10 | 0.02 | 0.1 | | 50 | 0 |
| LCC/TLCC |  | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| 0.5 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| |
| MDM14 and MDM16 |  | Thick Film, Molded | Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics | 100 | 1 | 0.05 | | | |
| 0.1 | 10 | 1 M |
| 0.2 |
| MDP14 and MDP16 |  | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | 100 | 1 | 0.125 | | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MP |  | Thin Film | Surface Mount Network | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA |  | Thin Film | SOT-143, 2 isolated Resistor Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MR |  | Metal Film or Wirewound | Resistor Networks, Wirewound or Metal Film Technologies | 50 | 0.1 | 0.1 | | 0.1 | 10 M |
| MSP |  | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| NOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | 10 | 0.025 | 0.05 | | 100 | 500 K |
| 0.4 |
| 0.5 |
| ORN |  | Thin Film | SOIC, 8 pin 4 Resistor | 25 | 0.025 | 0.1 | | | |
| 0.4 |
| Quick-Net® Prototypes |  | Thin Film | Guidelines | 25 | 0.1 | 0.025 | | 100 | 55 K |
| 200 | 120 K |
| 400 | 250 K |
| RMKD (CNP) |  | Thin Film | Hermetic, Dual-In-Line Packaged Resistor Networks | 0 | 0.1 | 0.125 | | 5000000. | 0. |
| RMKMS (CNM) |  | Thin Film | Molded, 50 Mil Pitch, Dual-In-Line Resistor Networks | 0 | 0.1 | 0.25 | | 5000000. | 2000000000. |
| SLCC |  | Thin Film | Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks | 0 | 0.1 | 0.5 | | | |
| SLR |  | Thin Film | Single Layer Resistor Carrier Networks | 50 | 0.05 | | | 10 | 500 K |
| SOGC 01,03,05 Schematics |  | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 100 | 1 | 1.6 | | 10 | 1 M |
| 2 |
| SOMC |  | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| TAS (CNS) |  | Thin Film | Conformal, Single-In-Line Resistor Networks | 0 | 0.1 | | | | |
| TDP |  | Thin Film | Dual-In-Line Molded 14-16 Pin Standard | 25 | 0.01 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.8 |
| TO: 1401 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1403 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1413 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1417 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1419 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1421 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TO: 1422 |  | Bulk Metal Foil | Glass to Metal Seal Headers | 2 | 0.005 | | | 5 | 80 K |
| TOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.75 |
| 1 |
| TSP |  | Thin Film | Single-In-Line Molded 6, 8, 10 Pin Standards Standard | 25 | 0.05 | 0.1 | | 100 | 200 K |
| 0.5 |
| 25 |
| VFB1012D (Z-Foil) |  | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) |  | Bulk Metal Foil | Hermetic Resistor Networks in Gull Wing Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSM85, 86, 87, 88, 89 |  | Bulk Metal Foil | Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration | 2 | 0.005 | | | 5 | 80 K |
| VSOR2000S1 |  | Thin Film | SOIC, V35 Terminator | 100 | 0.5 | 1.6 | | 50 | 125 |
| VTF (Custom) |  | Thin Film | Single-In-Line Conformal Custom | 10 | 0.01 | 0.1 | | 20 | 2 M |
| VTF (Standard) |  | Thin Film | Single-In-Line Conformal, 3-10 Pin Standards | 10 | 0.001 | | | | |
| VTSR, VSSR, VSOR |  | Thin Film | Molded, 25 or 50 Mil Pitch, Dual-In-Line Resistor Networks | 100 | 1 | | | 10 | 47 K |
| WOMC |  | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | 25 | 0.05 | 0.05 | | 100 | 500 K |
| 0.5 |
| 1 |
| Series | Technology | Description | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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