| Series | Technology | Description | Power (W) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | |
| CSC |  | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | 0.2 | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| MDP14 and MDP16 | | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | 0.125 | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MSP | | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | 0.2 | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| SOGC 01,03,05 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | 1.6 | 10 | 1 M |
| 2 |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | 0.08 | 10 | 1 M |
| 0.16 |
| Series | Technology | Description | Power (W) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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