| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | | |
| CRCA12E & S |  | Thick Film | Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 2012 | 10 | 1 M |
| 2512 |
| CRCC1206 | | Thick Film | Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 1206 | 10 | 1 M |
| MDP16-45 and MDP16-46 | | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | Resistor Networks | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| VFB1012D (Z-Foil) | | Bulk Metal Foil | Ultra High Precision Flip Chip Ball Grid Array Voltage Dividing Resistor | Resistor Networks | 0.05 | 0.01 | 0.2 | 1012 | 1000 | 10 K |
| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
|
