| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | | |
| CRCA12E & S |  | Thick Film | Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 2012 | 10 | 1 M |
| 2512 |
| CRCC1206 | | Thick Film | Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 1206 | 10 | 1 M |
| CSO | | Thin Film | SOIC, Ceramic Sandwich Custom Resistor Networks | Resistor Networks | 25 | 0.02 | 0.1 | | 100 | 1.5 M |
| 0.5 |
| DSM | | Bulk Metal Foil | High Precision Surface Mount Molded Voltage Divider | Resistor Networks | 2 | 0.01 | 0.1 | | 100 | 20 K |
| LCC/TLCC | | Thin Film | Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard | Resistor Networks | 25 | 0.1 | 0.05 | | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| 0.1 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| 0.5 | 10 | 120 K |
| 200 K |
| 250 K |
| 100 | 100 K |
| 1000 |
| 110 K |
| MP | | Thin Film | Surface Mount Network | Resistor Networks | 25 | 0.1 | 0.15 | | 250 | 50 K |
| MPD/MPDA | | Thin Film | SOT-143, 2 isolated Resistor Divider | Resistor Networks | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| MPM | | Thin Film | SOT-23 Molded 2 resistor Center-Tap Precision Divider | Resistor Networks, Divider | 25 | 0.05 | 0.1 | | 500 | 100 K |
| 0.2 |
| NOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Narrow Body Molded | Resistor Networks | 10 | 0.025 | 0.05 | | 100 | 500 K |
| 0.4 |
| 0.5 |
| SLR | | Thin Film | Single Layer Resistor Carrier Networks | Resistor Networks | 50 | 0.05 | | | 10 | 500 K |
| SOGC 01,03,05 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | Resistor Networks | 100 | 1 | 1.6 | | 10 | 1 M |
| 2 |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | Resistor Networks | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| TOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Medium Body Molded | Resistor Networks | 25 | 0.025 | 0.05 | | 100 | 100 K |
| 0.1 |
| 0.75 |
| 1 |
| VSM40, 42, 45, 46 (8, 14, and 16 Pin Side) | | Bulk Metal Foil | Hermetic Resistor Networks in Gull Wing Configuration | Resistor Networks | 2 | 0.005 | | | 5 | 80 K |
| VSM85, 86, 87, 88, 89 | | Bulk Metal Foil | Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration | Resistor Networks | 2 | 0.005 | | | 5 | 80 K |
| WOMC | | Thin Film | Dual In Line, SOIC , 14-16 Pin Wide Body Molded | Resistor Networks | 25 | 0.05 | 0.05 | | 100 | 500 K |
| 0.5 |
| 1 |
| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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