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Series Technology Description Type Typical TCR (ppm/C) Min. tolerance (%) Power (W) Case (EIA & Mil) Resistance (min) (Ohms) Resistance (max) (Ohms)
CRCA12E & S Thick Film Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination Resistor/Capacitor Networks 200 5 0.125 2012 10 1 M
2512
CRCC1206 Thick Film Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size Resistor/Capacitor Networks 200 5 0.125 1206 10 1 M
CS201 Thick Film Capacitor Networks, Single-In-Line, Coated SIP, ""D"" Profile, X7R and COG capacitors available, Multiple isolated capacitors, Multiple capacitors, common ground, Custom design capability Capacitor Networks 15 10
CS206 Thick Film Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP, 4 to 18 pins available, X7R and COG capacitors available, Low cross talk, Custom design capability Resistor/Capacitor Networks 200 2 0.125 10 1 M
0.8
0.9
1
8
9
10
70
CSC Thick Film Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack Resistor Networks 100 1 0.2 10 2.2 M
0.25
0.3
0.4
CZA04S & CZA06S Thick Film Surface Mount Chip Attenuator, Tolerance matching and temperature tracking superior to individual components, Maximum input power: 75 milliwatts for CZA06S; 40 milliwatts for CZA04S, Frequency range: DC to 3GHz Attenuators 0.04
0.075
DFM14 Thick Film Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test Resistor Networks 100 2 0.015
0.025 10 1 M
0.05
DFP14 and DFP16 Thick Film Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test Resistor Networks 50 2 10 1 M
MDM14 and MDM16 Thick Film, Molded Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Dual-In-Line Package, 01, 03, 05 Schematics Resistor Networks 100 1 0.05
0.1 10 1 M
0.2
MDP14 and MDP16 Thick Film, Molded Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack Resistor Networks 100 1 0.125 10 2.2 M
0.25 10 2.2 M
MDP16-45 and MDP16-46 Thick Film, Molded Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs Resistor Networks 100 2 0.125 MDP1645
150 5 MDP1646
MDRC Thick Film Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs Resistor/Capacitor Networks 100 2 2 50 50
68 68
75 75
81 81
100 100
121 121
130 130
162 162
195 195
260 260
510 510
MSM Thick Film Thick Film Resistor Networks, Military, MIL-PRF-83401 Qualified, Type RZ, Single-In-Line, Molded SIP; 01, 03, 05 Schematics Resistor Networks 100 2 0.36 10 1 M
0.48
0.6
0.8 10 1 M
0.84
0.88
1 10 1 M
1.08
1.32
1.4 10 1 M
1.8
MSP Thick Film Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible Resistor Networks 100 1 0.2 10 2.2 M
0.25
0.3
0.4
SIL-HR Thick Film High Reliability Network Resistors, Thick Film Technology Resistor Networks 2 0.1 46.4 1 M
0.18
0.5
0.7
0.8
0.9
SOGC 01,03,05 Schematics Thick Film Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Resistor Networks 100 1 1.6 10 1 M
2
SOGC, 45 and 46 Schematics Thick Film Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics Resistor Networks 100 2 1.6 150 150
180 180
270 270
330 330
820 820
2 150 150
180 180
270 270
330 330
820 820
SOMC Thick Film Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Resistor Networks 100 1 0.08 10 1 M
0.16
Zero ohm jumper Zero ohm jumper
T16L08, T16LR8 Thick Film Dual-In-Line, 8 Bit, R/2R Ladder Network for D/A and A/D Converter with Bi-Polar or CMOS Switches Resistor Networks, Ladder 100 25 K 100 K
Series Technology Description Type Typical TCR (ppm/C) Min. tolerance (%) Power (W) Case (EIA & Mil) Resistance (min) (Ohms) Resistance (max) (Ohms)
