| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | | |
| CS201 |  | Thick Film | Capacitor Networks, Single-In-Line, Coated SIP, ""D"" Profile, X7R and COG capacitors available, Multiple isolated capacitors, Multiple capacitors, common ground, Custom design capability | Capacitor Networks | 15 | 10 | | | | |
| CS206 | | Thick Film | Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP, 4 to 18 pins available, X7R and COG capacitors available, Low cross talk, Custom design capability | Resistor/Capacitor Networks | 200 | 2 | 0.125 | | 10 | 1 M |
| 0.8 |
| 0.9 |
| 1 |
| 8 |
| 9 |
| 10 |
| 70 |
| CSC | | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| DFP14 and DFP16 | | Thick Film | Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test | Resistor Networks | 50 | 2 | | | 10 | 1 M |
| MDP14 and MDP16 | | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | Resistor Networks | 100 | 1 | 0.125 | | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MDP16-45 and MDP16-46 | | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | Resistor Networks | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| MDRC | | Thick Film | Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs | Resistor/Capacitor Networks | 100 | 2 | 2 | | 50 | 50 |
| 68 | 68 |
| 75 | 75 |
| 81 | 81 |
| 100 | 100 |
| 121 | 121 |
| 130 | 130 |
| 162 | 162 |
| 195 | 195 |
| 260 | 260 |
| 510 | 510 |
| |
| MSP | | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| SIL-HR | | Thick Film | High Reliability Network Resistors, Thick Film Technology | Resistor Networks | | 2 | 0.1 | | 46.4 | 1 M |
| 0.18 |
| 0.5 |
| 0.7 |
| 0.8 |
| 0.9 |
| T16L08, T16LR8 | | Thick Film | Dual-In-Line, 8 Bit, R/2R Ladder Network for D/A and A/D Converter with Bi-Polar or CMOS Switches | Resistor Networks, Ladder | 100 | | | | 25 K | 100 K |
| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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