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Commercial Thick Film Resistor, Surface Mount Chip

 M Datasheet

Features

  • High purity alumina substrate for high power dissipation (2 W max.)
  • Wraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for + 150 °C operating conditions
  • High speed laser trimming for high volume requirements


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Documents

Datasheet
M
Packaging Information
Waffle Pack Packaging - Waffle Pack Packaging
Promotional Materials
Instructional Guide - Resistors 101 - Instructional Guide
Tape and Reel Info
Tape and Reel Specifications - 8 mm, 12 mm, 16 mm and 24 mm Embossed Conductive Tape Conforming to EIA-481
Technical Notes
Technical Note - Linear Film Resistors
Technical Note - Pulse Load Handling for Fixed Linear Resistors
Technical Note - Vishay Thin Film Lead Free Wraparound Process
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