The VSMP and VFCP Series utilizes ultra precision Bulk Metal® Z-Foil (BMZF)

The new Z-Foil technology provides a significant reduction of the resistive element sensitivity to changes of temperature due to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient).
The Z-Foil technology provides inherently an extremely low and predictable Temperature Coefficient of Resistance (TCR), a remarkably improved load life stability, low noise and availability of tight tolerance.
The VSMP has a full wrap around termination which insures safe handling during the manufacturing process, as well as providing stability during multiple thermal cyclings.
The VFCP Flip Chip configuration provides a significant PCB space saving of more than 35 % vs. the VSMP chip with wrap-around terminations.

Applications
• Automatic Test Equipment (ATE)
• High Precision Instrumentation
• Laboratory, Industrial and Medical
• Audio
• EB Applications (electron beam scanning and recording equipment, electron microscopes)
• Military and Space
• Airborne
• Down Hole instrumentation
• Communication

Selector guide
VSMP product page
VFCP product page
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