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SFN product information

NiCr Thin Film, Top-Contact Resistor

 SFN Datasheet

FEATURES

  • Wire bondable
  • Chip size: 0.020" square
  • Case: 0202


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Documents

Datasheet
Packaging Information
Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family
Product Literature
Product Overview - Wire Bondable Passive Components Product Family
Selector Guide - Military and Aerospace Applications
Product Support
Technical Questions
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