Application Note (2)
  Reference Data (1)
  Technical Note (4)
  Promotional Material (2)

Application Note
Application Note	Application of High Conductivity Traces in Thin Film
Application Note	Cost-effective High Volume Interconnect Thin Film Substrate Solutions

Reference Data
Characteristics & Capabilities	Patterned Substrate Products

Technical Note
Technical Note	Thin Film High-Density Integration (HDI) Design Guidelines
Technical Note	Substrate Design Guidelines
Technical Note	An Introduction to Substrate PIMIC Technology
Technical Note	Applications and Design of Plated and Filled Via Circuits

Promotional Material
Model HDI	Product Sheet
Pattern Substrates Using Thin Film Technology	Vishay Electro-Films Application-Specific Pattern Substrates Capabilities